Agc Inc.

Keisuke Hanashima

Kazutaka Ono

Shuhei Nomura

Yu Hanawa

Nobuhiko Takeshita

Shigeki Sawamura

Yuha Kobayashi

Seiki Ohara

Shinya Kikugawa

Shotaro Takenobu

Kohei Horiuchi

Kenta Kobayashi

Toshihisa Okada

Minoru Yamada

Koichi Shibuya

Satoko Noma

Kaede Katsuno

Shigeto Kumano

Yuichi Yoshida

Atsushi Yamada

To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in which a length of a side is equal to or larger than 300 mm and a thickness is equal to or larger than 0.5 mm.

Manufacturing method for glass substrate and glass substrate

A glass substratehas a mark provided on a surfaceA of the glass substrate, the mark including plural dots, a depth H of each of the dotsis 0.5 &#x3bc;m or larger and 7.0 &#x3bc;m or smaller, and an inclination angle of a side surfaceB of each of the dotsis 5&#xb0; or larger and 56&#xb0; or smaller.

Glass substrate

The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 &#x3bc;m to 300 &#x3bc;m, and an inclination angle due to the warpage of 0.0004&#xb0; to 0.12&#xb0;.

Glass substrate and laminated substrate

A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

Glass substrate, laminated substrate, laminated substrate manufacturing method, laminate, package, and glass substrate manufacturing method

The present invention provides a polymer optical waveguide containing: a core; and a cladding having a refractive index lower than that of the core, provided around the core, in which the polymer optical waveguide has a core-coupling section where at least a part of the cladding is not present along a light propagation direction of the polymer optical waveguide and an application type removal film A provided so as to come into contact with the core of the core-coupling section.

Polymer optical waveguide

A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.

Composition for bonding

Growing community of inventors

Tokyo, Japan

Keisuke Hanashima