Ebara Corporation

Keiichi Nojo

Kenichi Kobayashi

Asagi Matsugu

Akihiro Yazawa

Yasuyuki Miyasawa

Hideharu Aoyama

Manato Furusawa

Ayumu Saito

Tsuyoshi Soma

Yusuke Sasaya

To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure. A cleaning module includes a first transfer mechanism-, an ultrasonic cleaning tank, a transfer machine, and a second transfer mechanism-. The first transfer mechanism-is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release positionon a downstream side along a transfer passage. The ultrasonic cleaning tankis disposed at a position spaced apart from the transfer passageand is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machineis for transferring the substrate WF between the substrate grip or release positionof the transfer passageand the ultrasonic cleaning tank. The second transfer mechanism-is for transferring the substrate WF transferred to the substrate grip or release positionfrom the ultrasonic cleaning tankby the transfer machineto further downstream along the transfer passage

Transfer apparatus, cleaning module, and substrate processing apparatus

Growing community of inventors

Tokyo, Japan

Keiichi Nojo