Tokyo Electron Limited

Keiichi Enjoji

Toshiyuki Matsumoto

Masato Hayashi

Masami Yakabe

Mitsuhiro Yuasa

Naoki Ikeuchi

Koji Homma

A speaker unit has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe. A control unit determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.

Device, method and program for inspecting microstructure

A wafer supporting unit () includes a base () and a thermally conductive member (). The base is formed by nickel material. The thermally conductive member is formed in the shape of a lamina, includes silicone rubber () serving as the main material, and Ag fine powder () is blended with the silicone rubber. The Ag fine powder is blended with high density in part of the thermally conductive member, and a plurality of pillar-shaped regions () is formed with one end facing the bottom, and with the other end facing the top. The wafer supporting unit does not produce curvature in a wafer, and provides efficient cooling of the wafer, and does not cause heat degradation in a thermally conductive member prepared on the rear side of the wafer during processing.

Wafer supporter

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Tokyo, Japan

Keiichi Enjoji