Asahi Glass Company, Limited

Nec Corporation

Kazuyuki Hayashi

Takashi Sugiyama

Toshiyuki Uno

Kazuo Kadowaki

Masaki Mikami

Fujio Okumura

Shingo Watanabe

Junichi Funada

Kazunobu Maeshige

Masakazu Ono

Kenji Wakafuji

Junichi Kageyama

Ken Ebihara

Kohei Yoshida

Kazushi Sugyo

Ryota Nihei

Takeru Kinoshita

Hiroshi Hanekawa

Provided is a display antenna including a display including a plurality of light emitters arranged in a grid, an antenna array having an antenna assembly in which a plurality of patch antennas through which light in a wavelength band of a visible region is transmitted is disposed in a grid, the antenna array being disposed to be superimposed on the display, and a phase shifter disposed in a gap region sandwiched between the plurality of light emitters, connected to at least one of the plurality of patch antennas, and configured to shift a signal to be transmitted and received.

Display antenna

Provided is an antenna device including an antenna array including a plurality of patch antennas arrayed in a grid, a first switch group including a first switch disposed on a wiring line connecting two adjacent patch antennas, and a second switch group including a second switch disposed on a wiring line between an antenna assembly formed by at least four adjacent patch antennas and a signal source connected to at least one patch antenna constituting the antenna assembly.

Antenna device and display antenna

A reflective mask blank, which includes a substrate, a reflective multilayer film for reflecting exposure light, and an absorber layer for absorbing the exposure light in this order; the reflective multilayer film having at least three fiducial marks formed in a concave shape in an area outside an exposure area for patterning the reflective multilayer film on a front side thereof, each of the fiducial marks including a concave portion having an inclination angle &#x3b1;, the absorber layer having a film thickness of from 40 to 90 nm; the absorber layer having transferred marks formed in a concave shape on a front side thereof, the transferred marks being transferred from the at least three fiducial marks, each of the transferred marks including a concave portion having an inclination angle of from 35 to 80&#xb0;; and a difference between the inclination angle &#x3b2; and the inclination angle &#x3b1; (inclination angle &#x3b2;&#x2212;inclination angle &#x3b1;) being at least 10&#xb0;.

Reflective mask blank and process for producing the reflective mask blank

A substrate with a conductive film to be used for producing a reflective mask blank for EUV lithography, comprising a substrate and a conductive film formed on the substrate, wherein the conductive film has at least two layers of a lower layer formed on the substrate side and an upper layer formed on the lower layer; the lower layer is a CrN type film which contains Cr and N; the upper layer is a CrON type film which contains Cr, N and O; in the CrN type film, the total content of Cr and N is at least 85 at %, and the compositional atomic ratio of Cr to N is Cr:N=9.5:0.5 to 3:7; in the CrON type film, the total content of Cr, N and O is at least 85 at %, and the compositional atomic ratio of Cr to (N+O) is Cr:(N+O)=9.5:0.5 to 3:7; and the film thickness of the CrON type film is from 0.5 to 3 nm, and the standard deviation of the film thickness distribution of the CrON type film is at most 0.18 nm.

Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production

To provide an EUV mask blank which has an absorber layer having such a structure that the phase difference between a reflective layer and the absorber layer is in the vicinity of 180&#xb0;, and the change of the phase difference between the reflective layer and the absorber layer is small to the film thick change of the absorber layer, and of which the absorber layer can be expected to be further thinner than a conventional absorber layer. A reflective mask blank for EUV lithography, comprising a substrate, and a reflective layer for reflecting EUV light and an absorber layer for absorbing EUV light formed in this order on the substrate,

Reflective mask blank for EUV lithography

A process for producing a reflective mask blank for EUV lithography (EUVL), which comprises forming a multilayer reflective film for reflecting EUV light on a film-forming surface of a substrate, then forming a protective layer for protecting the multilayer reflective film, on the multilayer reflective film, and forming an absorber layer for absorbing EUV light, on the protective layer, to produce a reflective mask blank for EUVL, wherein the multilayer reflective film is a Mo/Si multilayer reflective film, the protective layer is a Ru layer or a Ru compound layer, the absorber layer is a layer containing at least Ta and N, and after forming the Mo/Si multilayer reflective film, the protective layer is formed, and after forming a Si thin film or Si oxide thin film having a thickness of at most 2 nm on the protective layer, the absorber layer is formed.

Reflective mask blank for EUV lithography, and process for its production

To provide an EUV mask blank with which the etching selectivity under etching conditions for absorber layer is sufficiently high, line edge roughness after pattern formation will not be large, and a pattern with high resolution can be obtained. A reflective mask blank for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light, an absorber layer for absorbing EUV light and a hard mask layer formed in this order on the substrate;

To provide a substrate with a conductive film for an EUV mask blank, which has a conductive film having a low sheet resistance, excellent surface smoothness and excellent contact to an electrostatic chuck, and with which deformation of the substrate by the film stress in an EUV mask blank can be suppressed. A substrate with a conductive film to be used for producing a reflective mask blank for EUV lithography, comprising a conductive film formed on a substrate;

Substrate with conductive film, substrate with multilayer reflective film and reflective mask blank for EUV lithography

To provide an EUV mask blank provided with a low reflective layer, which has excellent properties as an EUV mask blank. A reflective mask blank for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light, an absorber layer for absorbing EUV light and a low reflective layer to an inspection light (wavelength: 190 to 260 nm) for a mask pattern, formed in this order on the substrate, wherein the low reflective layer has a stacked structure having a first layer containing at least 95 at % in total of silicon (Si) and nitrogen (N), and a second layer containing at least 95 at % in total of tantalum (Ta), oxygen (O) and nitrogen (N) or a second layer containing at least 95 at % in total of tantalum (Ta) and nitrogen (N), stacked in this order from the absorber layer side.

Reflective mask blank for EUV lithography and process for producing the same

To provide a reflective mask blank for EUV lithography having an absorber layer having optical constants suitable for reducing the thickness. A mask blank for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light and an absorber layer for absorbing EUV light formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta) and palladium (Pd), and in the absorber layer, the content of tantalum (Ta) is from 10 to 80 at %, the content of palladium (Pd) is from 20 to 90 at %, and the total content of Ta and Pd is from 95 to 100 at %.

A reflective mask for an extreme ultra violet (EUV) lithography obtained by forming a mask pattern in an absorber layer of an reflective mask blank is useful in semiconductor production. The EUV reflective mask has two regions of a mask pattern region and a region outside the mask pattern region. The mask pattern region has the absorber layer and a non-absorber layer on the reflective layer of an substrate, wherein the region outside the mask pattern region has an EUV reflective layer, an EUV absorber layer, and a light shielding layer for suppressing reflection of EUV light and DUV-Vis light having a wavelength of from 190 to 500 nm. The EUV reflective mask reduces unnecessary exposure of resist formed on a substrate to reflected light from the region outside the mask pattern region and reduces a pattern size to produce an accurate transfer pattern.

Reflective mask blank for EUV lithography and reflective mask for EUV lithography

Provision of a reflective mask blank for EUV lithography having an absorber layer having optical constants suitable for reducing the film thickness. A reflective mask blank for EUV lithography comprising a substrate and a reflective layer for reflecting EUV light and an absorber layer for absorbing EUV light, that are formed in this order on the substrate;

A reflective mask blank for EUV lithography having a low-reflective layer which has a low reflectivity with respect to wavelengths of EUV light and a mask pattern inspection light and which satisfies a predetermined reflectivity (405 nm: &#x3c;40%, 600 to 650 nm: 30 to 50%, 800 to 900 nm: &#x3e;50%, 1,000 to 1,200 nm: &#x3c;90%) in a wavelength region (400 to 1,200 nm) required for the mask production process and the pattern transcription process. A reflective mask blank for EUV lithography having a reflective layer for reflecting EUV light, an absorbing layer for absorbing EUV light and a low-reflective layer with respect to a mask pattern inspection light (wavelength: 190 to 260 nm), which are formed in this order on a substrate, wherein the low-reflective layer contains at least tantalum (Ta), oxygen (O) and hydrogen (H), and the low-reflective layer has a Ta+O total content that is between 85 and 99.9 at % and an H content that is between 0.1 and 15 at %.

Provision of an EUV mask whereby an influence of reflected light from a region outside a mask pattern region is suppressed, and an EUV mask blank to be employed for production of such an EUV mask. A reflective mask for EUV lithography (EUVL), comprising a substrate having a mask pattern region and an EUV light-absorbing region located outside the mask pattern region; a reflective layer provided on the mask pattern region of the substrate for reflecting EUV light and having a portion on which an absorber layer is present and a portion on which no absorber layer is present; the portion on which an absorber layer is present and the portion on which no absorber layer is present being arranged so as to constitute a mask pattern;

Reflective mask blank for EUV lithography and mask for EUV lithography

To provide a reflective mask blank for EUV lithography having a low reflective layer having a low reflectance in the wavelength region of EUV light and an inspection light for a mask pattern, particularly having low reflection properties in the entire wavelength region (190 to 260 nm) of an inspection light for a mask pattern, and having a high etching rate in chlorine type gas etching. A reflective mask blank for EUV lithography, comprising a substrate, and a reflective layer to reflect EUV light, an absorber layer to absorb EUV light and a low reflective layer to an inspection light (wavelength:190 nm to 260 nm) for a mask pattern, formed in this order over the substrate, wherein the low reflective layer contains silicon (Si) and nitrogen (N) in a total content of at least 95 at %, has a Si content of from 5 to 80 at %, and a N content of from 15 to 90 at %.

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Chiyoda-ku, Japan

Kazuyuki Hayashi