Sumitomo Sitix Corporation

Kazuyoshi Manako

A cleaning equipment for semiconductor substrates, which includes a cleaning tank 2 for cleaning the semiconductor substrates and a circulation filtering device, wherein the cleaning equipment has a pump 6 and a filter unit 7 disposed in a filtering line for cleaning impurities contained in a cleaning liquid, a gas mixing device 8 having a temperature-adjusting function and which is disposed downstream of the pump 6 and the filter unit 7 for adjusting a temperature of the cleaning liquid and dissolving the gas into the cleaning liquid, and a gas-separating device 9 which is disposed downstream of the gas mixing device 8 for separating an undissolved portion of the mixed gas from the cleaning liquid.

Cleaning equipment for semiconductor substrates

A semiconductor wafer cleaning liquid includes an aqueous hydrogen fluoride (HF) solution having a HF concentration between 0.03% and 0.05% by weight, which is adjusted to 20.degree. C. or below and into which ozone is directly dissolved up to a saturation point. A method for cleaning semiconductor wafers incudes the steps of charging an aqueous HF solution adjusted to 20.degree. C. or below and having an HF concentration between 0.03% and 0.05% by weight into a treatment bath; dissolving ozone into the aqueous solution up to a saturation point to prepare a cleaning liquid; dipping to etch semiconductor substrate into the cleaning liquid in the treatment bath; and rinsing the semiconductor substrate with pure or ozone-dissolved water in a bath separate from the treatment bath.

Growing community of inventors

Saga, Japan

Kazuyoshi Manako