Tokyo Electron Limited

Kazuya Iwanaga

Yoshifumi Amano

Masato Hayashi

Eiichi Sekimoto

Yuki Ito

Ryoji Ikebe

Eiichiro Okamoto

Shoichiro Hidaka

Boui Ikeda

There is provided a substrate processing apparatus, including: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configured to supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.

Substrate processing apparatus and substrate processing method

Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.

Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium

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Kumamoto, Japan

Kazuya Iwanaga