Kabushiki Kaisha Toshiba

Kioxia Corporation

Renesas Electronics Corporation

Toshiba Memory Corporation

Mitsubishi Electric Corporation

Renesas Technology Corp.

Kazuya Fukuhara

Soichi Inoue

Takashi Sato

Masamitsu Itoh

Satoshi Tanaka

Toshiya Kotani

Kenji Kawano

Shoji Mimotogi

Masato Suzuki

Kazuyuki Masukawa

Takashi Hirano

Takehiko Ikegami

Kiyonori Yoshitomi

Yujiro Kawasoe

Masaki Mitsuyasu

Nobuhiro Komine

Manabu Takakuwa

Daisuke Kawamura

Tatsuhiko Higashiki

Masayuki Hatano

Kazuhiro Takahata

Takuya Kono

Yasunobu Kai

Tetsuya Kugimiya

Akiko Mimotogi

Satoshi Nagai

Takaki Hashimoto

Hiroyuki Kashiwagi

Kazutaka Ishigo

Kentaro Kasa

Masaki Satake

Anupam Mitra

Tetsuro Nakasugi

Shinichi Ito

Ryoichi Suzuki

Eishi Shiobara

Masafumi Asano

Hiroko Nakamura

Kei Hayasaki

Ryuichi Ishii

Kenji Chiba

Shingo Kanamitsu

Yosuke Okamoto

Masaru Fuku

Kyoko Izuha

Kazuyuki Misumi

Noriyuki Besshi

Hidenori Sato

Hidefumi Mukai

Kazuhiro Segawa

Yosuke Kitamura

Yoshinori Hagio

Kazushi Hatauchi

Keita Asanuma

Sachiko Kobayashi

Yuu Yamayose

Yohko Komatsu

Michiya Takimoto

Kunihiro Yamashita

Katsuyuki Fukudome

Kazuo Tawarayama

Motoko Suzuki

Shinya Mizusaki

Yuki Murasaka

Jun Watanabe

According to one embodiment, a template includes a base material with a first surface at a first level. A first pattern on the template includes first protruding portions in a first region that protrude to a second level beyond the first level, a first recess portion between an adjacent pair of first protruding portions in a central portion of the first region, and a second recess portion between another adjacent pair of first protruding portions in an outer peripheral portion of the first region. A second pattern on the template includes a protrusion portion in a second region outside the first region. The protrusion portion protrudes to a third level. An optical layer is in the first recess portion and at least a portion of a bottom surface of the second recess portion is not covered by the optical layer.

Template, method for manufacturing template, and method for manufacturing semiconductor device

A power semiconductor device includes: a plurality of power modules including control terminals; a heat sink, on which the plurality of power modules are mounted; and a control substrate, to which the control terminals are fixed. The plurality of power modules each include a first protruding portion close to the control terminals, and a second protruding portion far from the control terminals. The heat sink has, at a position corresponding to the first protruding portion, a first recessed portion formed to have an inner diameter larger than an outer diameter of the first protruding portion, and engaged with the first protruding portion. At a position corresponding to the second protruding portion, the heat sink has a second recessed portion formed to have the shape of an elongated hole whose minor diameter is larger than an outer diameter of the second protruding portion, and engaged with the second protruding portion.

Power semiconductor device and method for manufacturing power semiconductor device

An imprint apparatus includes a moveable substrate support configured to hold a substrate having a transfer target material thereon, a template holder configured to hold a template in which a pattern, which is to be transferred to the transfer target material, is formed, a light source configured to emit light at different selectable intensities toward the transfer target material, and a controller. The controller includes a processing unit and a storage unit, and is configured to retrieve exposure conditions for the transfer target material and control the intensity, and timing of initiation, of the light output by the light source, based on the retrieved exposure conditions, such that the transfer target material is subjected to main curing after undergoing temporary curing.

Imprint apparatus and imprint method

An imprinting device includes an aligner configured to adjust a relative position between an original plate and a substrate when the original plate including a pattern is moved into contact with the substrate including a transfer target material; a first irradiator configured to irradiate the transfer target material with first light based on an irradiation condition before adjusting the relative position; a second irradiator configured to cure the transfer target material by irradiating the transfer target material with second light after adjusting the relative position; an index acquirer configured to acquire an accuracy index indicating an adjustment accuracy of the adjusted relative position; a memory configured to store data including a plurality of the accuracy indexes acquired for a plurality of the substrates; and a controller configured to adjust the irradiation condition when subsequently using the first irradiator based on the data.

Imprinting device, imprinting method, and method for manufacturing semiconductor device

An imprinting method includes placing a template onto non-solidified resin that is applied onto a surface of a substrate, such that the non-solidified resin extends into a pattern of the template in a surface direction of the substrate, starting first alignment operation to align the template with the substrate using a first alignment mark at a first timing, and starting a second alignment operation to align the template with the substrate using a second alignment mark at a second timing after the first timing. The first timing is when the non-solidified resin has extended into the first alignment mark and not yet into the second alignment mark. The second timing is when the non-solidified resin has extended into the first and second alignment marks.

Imprinting method and imprinting apparatus

According to one embodiment, an imprint apparatus includes a first light source positioned to irradiate a substrate with light, a second light source positioned to irradiate the substrate with light, an illuminance changing portion selectively configured to change the illuminance distribution of light from the first light source on an irradiation surface on the substrate, and a controller configured to control the first light source, the second light source and the illuminance changing portion to irradiate the substrate with light from the first light source, and to subsequently irradiate the substrate with light from the second light source directly through the template.

Imprint apparatus, imprint method, and method of manufacturing semiconductor device

According to one embodiment, an imprint lithography template comprises a substrate transparent to ultraviolet light. A first mesa region is on the substrate. A surface of the first mesa region includes a pattern region to be pressed into a photocurable resist film. The pattern region having four sides. A second mesa region is also on the substrate. The first mesa region protrudes from a surface of the second mesa region. A blocking film is adjacent to two sides of the four sides pattern region. The two sides to which the blocking film is adjacent are connected to each other at a corner of the pattern region. The blocking film blocks ultraviolet light.

Template, patterning method, and method for manufacturing semiconductor device

A template includes: a base material having a surface including a first pattern, a second pattern and a third pattern, the first pattern including a first recess, the second pattern including a second recess. The base material containing a first material having a first refractive index; a first layer disposed in the first recess and containing a second material, the second material having a second refractive index different from the first refractive index; and a second layer disposed in the second recess, containing the second material, and being thicker than the first layer.

Template, template manufacturing method, and semiconductor device manufacturing method

An imprint device, including a template which has a first surface and a second surface opposite to the first surface, and is provided with a pedestal portion on the first surface, the pedestal portion defining a pattern; a holding portion configured to hold the template; and a magnification adjustment unit disposed at a position corresponding to the pattern of the pedestal portion on a second surface side of the template without contacting the template.

Imprint device, imprint method and method of manufacturing semiconductor device

According to one embodiment, a stencil mask includes a first opening and a second opening, the first opening is provided corresponding to a mark region in a template, the second opening is provided adjacent to the first opening, and the diameter of a circle circumscribing the second opening is smaller than the diameter of a circle circumscribing the first opening.

Stencil mask, stencil mask manufacturing method, and imprinting method

A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Pattern accuracy detecting apparatus and processing system

In a pattern shape adjustment method according to one embodiment, a correspondence relation between a first shape feature amount of a first on-substrate pattern formed on a first substrate and a first laser band width of laser light as exposure light used when forming the first on-substrate pattern is acquired. Also, a second shape feature amount of a second on-substrate pattern actually formed on a second substrate is measured. Then, a second laser band width according to the shape of a third on-substrate pattern to be formed on a third substrate is calculated based on the correspondence relation and the second shape feature amount. Further, the third substrate is exposed to laser light having the second laser band width.

Pattern shape adjustment method, pattern shape adjustment system, exposure apparatus, and recording medium

According to an embodiment, mask manufacturing equipment includes a detector, an irradiator, a calculator, and a controller. The detector detects positional deviation of a pattern formed on a mask substrate. The irradiator irradiates the mask substrate with laser light to form a heterogeneous layer that is expanded in volume in the mask substrate. The calculator calculates an area periphery irradiation condition under which the irradiator is caused to emit laser light to a peripheral area of the pattern on the basis of the positional deviation detected by the detector so that the pattern area is reduced by forming the heterogeneous layer in the peripheral area of the pattern. The controller controls the irradiator to form the heterogeneous layer in the peripheral area of the pattern according to the area periphery irradiation condition.

Mask manufacturing equipment and mask manufacturing method

According to one embodiment, an imprint method comprises coating a photo-curable organic material on a film to be processed, bringing a concave-convex pattern of a template into contact with the photo-curable organic material, applying a force to the template in such a state that the template is brought into contact with the photo-curable organic material, curing the photo-curable organic material by irradiating light onto the photo-curable organic material, in such a state that the template is brought into contact with the photo-curable organic material, and releasing the template from the photo-curable organic material after the light irradiation. The force applied to the template corresponds to a gap between a surface of the film to be processed and the template.

Imprint method and imprint system

Growing community of inventors

Tokyo, Japan

Kazuya Fukuhara