Fujitsu Corporation

Adv Antest Corporation

Other

Fujuitsu Limited

Kazushi Ishida

Hiroshi Yasuda

Yoshihisa Ooae

Akiyoshi Tsuda

Hitoshi Tanaka

Nobuyuki Yasutake

Tatsuro Ohkawa

Tohru Ikeda

Akio Yamada

Toshiaki Tanaka

Ei Yano

Yukio Takigawa

Kenichi Kawakami

Kazutoshi Hayashi

Kouzi Takahata

Hideo Nabetani

Kawakami Kenichi

Naoki Nishio

Tooru Ikeda

Kouji Takahata

Disclosed is a method of readily removing particles from a stage, that is, a stage particle removing method for removing particles from a stage that holds a planar workpiece. A resin film is placed on the stage, and collected from the stage. The resin film is coated over at least one surface of the planar workpiece such as a semiconductor wafer or glass substrate. The resin film is brought into contact with the stage. The resin film may not be coated over the planar workpiece itself but may be coated over a dedicated planar piece shaped similarly to the planar workpiece, for example, a thin metallic plate that is very smooth. The used resin film is peeled off from the planar workpiece or dedicated planar piece, and the resin film is coated again. Thus, the planar workpiece or dedicated planar piece can be reused.

Method of removing particles from stage and cleaning plate

With using one scanning stage 19 where a plurality of wafers 16A to 16E is mounted through wafer holders 20A to 20E and balancing stage 21 disposed below scanning stage 19, scanning stage 19 is scanned based on exposure data common to a plurality of charged particle beam exposure apparatus 10A to 10E, and balancing stage 21 is scanned so that barycenter G of scanning stage 19 and balancing stage 21 becomes a fixed point. The positions of reflecting mirrors 70L and 70R secured to stage 19 are measured and based on their values, the expansion/contraction ratio of stage 19 and the positions of samples 16A to 16E are calculated to obtain deviation of the positions from target positions. Stage 19 is modeled such that rigid areas 19A to 19E are loosely connected, and for each area, the positions of three points are measured to calculate deviation of the exposure target position due to rotation of each ridged area. These deviations are corrected by deflectors 18A to 18D.

Method and system for charged particle beam exposure

Method for charged particle beam exposure with fixed barycenter through

The present invention is a charged particle beam exposure apparatus comprising: a column portion in which an optical system for a charged particle beam is disposed; a chamber to be coupled with the column portion; a movable sample stage located in the chamber for mounting a sample thereon; and a stage position measurement device, having an optical path for measurement, along which a laser beam having a predetermined frequency is projected and is reflected by reflection means provided on the sample stage, and an optical path for reference, which in length almost equals a distance between a starting point of the optical path for measurement and the origin of the optical system in the column portion and for which the length is increased at a rate substantially consistent with a thermal expansion coefficient as material of the chamber is expanded, for measuring a change in position of the sample stage by employing a laser optical signal for measurement, which passes along the optical path for measurement, and a reference laser signal, which passes along the optical path for reference.

Charged particle beam exposure apparatus

A charged particle beam exposure method is adapted to an exposure apparatus which includes a plurality of exposure systems that simultaneously expose the same pattern. The method includes the steps of (a) generating, by a pattern generating unit in each exposure system, data related to patterns which are to be exposed, (b) deflecting, by a column unit in each exposure system, a charged particle beam onto an object which is mounted on a stage by deflecting the charged particle beam based on the data generated by the pattern generating unit in a corresponding exposure system, and (c) detecting an abnormality in the exposure apparatus during operation of the exposure apparatus based on data which are obtained from corresponding parts of the exposure systems.

Charged particle beam exposure method and apparatus

An electron-beam exposure device having at least one deflector for deflecting an electron beam and detecting a position of a position-detection mark with the electron beam includes a plurality of detectors detecting electrons scattered from the position-detection mark, a plurality of amplifiers, each of the amplifiers amplifying an output of a corresponding one of the detectors, and a setting unit for setting amplification factors of the amplifiers such that a magnitude of an output from each of the amplifiers is constant irrespective of a deflected position of the electron beam at a time of detection of the position of the position-detection mark.

Electron-beam exposure device and a method of detecting a mark position

An X-Y stage includes a base having a first guide rail extending in a first direction, a stage having a second guide rail extending in a second direction perpendicular to the first direction, where the stage is movable with respect to the base in mutually perpendicular directions X and Y, and a slider arranged between the base and the stage and having a plurality of first wheels provided with respect to the first guide rail and rotatable under guidance of the first guide rail and a plurality of second wheels provided with respect to the second guide rail and rotatable under guidance of the second guide rail. The first wheels block a movement of the slider in the second direction by engaging the first guide rail when the stage moves in the second direction, and the second wheels block a movement of the slider in the first direction by engaging the second guide rail when the stage moves in the first direction. In addition, the slider is arranged in at least three locations.

X-Y stage and charged particle beam exposure apparatus

A push button switch employing a dome spring switch element mounted in a vertical orientation relative to a generally horizontal orientation of a bottom support plate, and a key top and associated plunger which are mounted for limited, reciprocating vertical movement. An actuator, comprising a coil spring and a pivotally mounted lever, interconnects the plunger and the spring dome and is responsive to and converts vertical downward movement of the plunger to a horizontally directed depressing force on the dome spring for inverting the dome spring in a snap action and completing an electrical connection between inner and outer contacts mounted within the switch element and underlying the dome spring. A dome spring of rectangualr shape affords improved force versus displacement and snap action characteristics, and a contact frame providing flexible support of the inner contacts reduces impact shock and wear produced by the snap action. A locking structure provides for locked interengagement of the key top and plunger and a stepped, flexible stop absorbs shock and reduces impact noise in stopping the return movement of the plunger from a depressed to a normal condition. A direct drive connection between the plunger and the lever reduces the amount of plunger movement and depression force required to actuate the switch under abnormal load conditions. A process for fabrication of the switch element by stamping and molding steps reduces costs and improves reliability of the switch element.

Push button switch using dome spring and switch element thereof

Growing community of inventors

Kawasaki, Japan

Kazushi Ishida