Tokyo Electron Limited

Kazuki Motomatsu

Satoshi Kaneko

Kazunori Sakamoto

Akira Murata

A substrate liquid processing apparatus configured to perform a heating control over a processing liquid on a substrate with high accuracy in a unit of zones is provided. The substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a processing liquid supply configured to supply the processing liquid onto a processing surface of the substrate; and a heating unit configured to heat the processing liquid on the processing surface. The heating unit includes a heater, and a first sheet-shaped body and a second sheet-shaped body which are disposed to face the heater therebetween. The heater includes multiple heating elements provided in multiple heating zones of the heating unit.

Substrate liquid processing apparatus

A substrate processing apparatus can suppress particle generation on a substrate, and can reduce a consumption amount of a processing liquid. A substrate processing apparatusincludes a processing chamberhaving a processing spacein which a substrate W is processed; a vaporizing tank, configured to store the processing liquid therein, having a vaporization spacein which the stored processing liquid is allowed to be vaporized; a decompression driving unitconfigured to decompress the vaporization space; and a control unit. The control unitvaporizes the processing liquid into the processing gas by decompressing the vaporization spacewithout through the processing space, and then, vaporizes the processing liquid into the processing gas by decompressing the vaporization spacethrough the processing space, and supplies an inert gas into the vaporization space

Substrate processing apparatus, substrate processing method and recording medium

A substrate liquid processing apparatusincludes a substrate holding unitconfigured to hold a substrate W; a processing liquid supply unitconfigured to supply a processing liquid Lonto a top surface of the substrate W held by the substrate holding unit; and a cover bodyconfigured to cover the substrate W. Here, the cover bodyincludes a ceiling unitdisposed above the substrate W, a sidewall unitdownwardly extended from the ceiling unit, and a heating unitprovided at the ceiling unitand configured to heat the processing liquid Lon the substrate W. The sidewall unitof the cover bodyis placed at an outer periphery side of the substrate W when the processing liquid Lon the substrate W is heated.

Substrate liquid processing apparatus, substrate liquid processing method and recording medium

A heat exchange systemincludes heat exchangersandthat heat or cool a fluid passing therethrough; a fluid supply unitthat supplies the heating target fluid or the cooling target fluid into lower portions thereof; and a fluid discharge unitthat discharges the heated fluid or the cooled fluid from upper portions thereof. The fluid supply unit includes inlet linesandthrough which the fluid is introduced; a first manifoldlocated above the upper end portion of the heat exchangers and connected with the inlet lines; a gas exhaust linethat is connected to the first manifold and exhausts a gas mixed in the fluid; a supply linethat supplies the fluid from the first manifold. While passing through the heat exchangers from the lower portions toward the upper portions thereof, the fluid is heated or cooled.

Heat exchange system, and substrate processing apparatus having same

A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substratefrom a first nozzletoward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position Plocated at a central portion to an entire region treatment end position Plocated at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position Plocated at an outer position than the entire region treatment start position P, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position Pto a peripheral region treatment stop position Plocated at a peripheral portion.

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Koshi, Japan

Kazuki Motomatsu