Hitachi-high-technologies Corporation

Toyota Jidosha Kabushiki Kaisha

Kazuhiro Zama

Yusuke Miyazaki

Masayuki Hachiya

Koichi Asami

Hiroyuki Kawakami

Kazuo Takahashi

Masami Ooyama

Keiichi Nagasaki

Yuuichiro Iijima

Taisuke Nomiyama

Rieko Hachiya, Legal Representative

Noriyuki Aizawa

Shingo Tanaka

Takahiro Jingu

Kimiko Hachiya, Legal Representative

An imaging method includes irradiating an object, from an irradiator, with mixed light of light in a first wavelength band and light in a second wavelength band having an intensity higher than an intensity of the first wavelength band, the first wavelength band being a wavelength band correlating with a first filter having a first transmission wavelength characteristic, and the second wavelength band being a wavelength band correlating with a second filter having a second transmission wavelength characteristic different from the first transmission wavelength characteristic; imaging the object irradiated with the mixed light by using the imaging element; and generating composite image data by high dynamic range synthesis of first layer image data and second layer image data, among image data of the object output by the imaging element.

Imaging method

In order to enable high accuracy positioning and strong pressing of a substrate, the present invention provides a substrate holding apparatus including: a rotating bed having an inclined surface supporting a lower side of an outer circumferential side surface of the substrate, which bed rotates on a normal line of the substrate as the rotation axis together with the substrate; a position restriction unit rotating together with the rotating bed and restricting the substrate in a predetermined position on the rotating bed by pressing a plurality of points on the circumference on an upper side of the outer circumferential side surface of the substrate prior to the rotation; and a pressing unit rotating together with the rotating bed and pressing the substrate against the inclined surface by pressing a plurality of points on the upper side of the outer circumferential side surface of the substrate during the rotation.

Object holding apparatus, and inspection apparatus

An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.

Inspection apparatus and inspection method

A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.

Optical defect inspection apparatus

A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.

Wafer surface inspection apparatus and wafer surface inspection method

The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.

Substrate holding apparatus, and inspection or processing apparatus

An outer dust collecting filter covers a casing an intake port and an outer fan flows air from an external environment into the casing via the outer dust collecting filter. A clean chamber has an intake port within the casing, an inner dust collecting filter for covering the intake port, and an inner fan for flowing the air within the casing. A control unit controls fan rotating speeds so that a measured pressure within the casing becomes higher at a set value than a measured pressure in the external environment, and a measured pressure within the clean chamber becomes higher at a set value than the measured pressure within the casing.

Growing community of inventors

Mito, Japan

Kazuhiro Zama