Tokyo Electron Limited

Kazuhiro Kanaya

Kimihiro Fukasawa

Tatsuya Ogi

Wataru Ozawa

Noriaki Shimizu

Jun Shoji

Provided is a parallel flat-panel type plasma processing apparatus which includes a recipe storing unit storing a processing recipe for performing a plasma processing, a compensation setting unit setting an accumulation time of the plasma processing or the number of processed substrates after starting using a new second electrode and the compensation value of the set temperature of the second electrode in an input screen, and a storage unit storing the compensated set value. The plasma processing apparatus is further equipped with a program for controlling a temperature adjusting mechanism based on a set temperature after compensation by adding a set temperature of an upper electrode written in the processing recipe to the compensation value stored within the storage unit. As a result, the non-uniformity in the plasma processing between the substrates caused by the change of processing atmosphere is suppressed.

Plasma processing apparatus, plasma processing method, and storage medium

A substrate processing system allows to reduce the number of works that should be done by a software engineer. The systemincludes a substrate processing apparatus; a substrate processing controllerfor controlling the substrate processing apparatus; and a serverfor storing therein commands, i.e., instructional statements, for defining an operation of each device. The substrate processing controllerhas a RAMserving as a work space for creating a macro file corresponding to each of processes divided from the whole substrate processing or for changing the content of a macro file; and an executorcomposed of, e.g., CPU for executing a process sequence macro obtained by a combination of the created macro files. The user creates a macro file describing a sequential operation of each process or changes the content of a macro file by arranging the stored commands.

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Kurokawa-gun, Japan

Kazuhiro Kanaya