Tokyo Electron Limited

Kazuhiro Aiura

Norihiro Ito

Yoshifumi Amano

Norihiro Itoh

Naoki Shindo

Takashi Nagai

Yosuke Hachiya

Jiro Higashijima

Yusuke Hashimoto

Nobuhiro Ogata

Satoru Tanaka

Yuichi Douki

Takahisa Otsuka

Meitoku Aibara

Kazuyoshi Shinohara

Yuki Yoshida

Yuki Ito

Daisuke Goto

Tatsuhiro Ueki

Hidetoshi Nakao

Tsuyoshi Fukushima

A substrate processing apparatus includes: a substrate rotator configured to hold and rotate a substrate; an outer cup configured to annularly cover a periphery of the substrate held by the substrate rotator; an inner cup disposed inside the outer cup and under the substrate held by the substrate rotator; an annular drain formed between the outer cup and the inner cup to discharge a processing liquid supplied to the substrate outward; and an exhaust passage formed inside the inner cup, wherein the inner cup has an exhaust hole through which a liquid reception space, which is formed by the inner cup and the outer cup, and the exhaust passage are in communication with each other, and the exhaust hole is formed obliquely downward from an outer surface to an inner surface of the inner cup.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus includes a holder, a nozzle arm and a position adjusting device. The holder is configured to hold a substrate. The nozzle arm has a nozzle configured to supply a processing liquid to a peripheral portion of the substrate. The position adjusting device is provided at the nozzle arm and is configured to adjust a position of the substrate to a given position on the holder.

A processing liquid ejection nozzle ejects a processing liquid used for a substrate processing. The processing liquid ejection nozzle includes a nozzle main body and an angle changing mechanism. The nozzle main body includes a first main body formed with a first flow path therein which communicates with a processing liquid supply path, and a second main body bent from the first main body and formed with a second flow path therein which communicates with the first flow path. The angle changing mechanism changes an angle of the nozzle main body in a horizontal direction with respect to a fixing member to which the nozzle main body is fixed.

Processing liquid ejection nozzle, nozzle arm, substrate processing apparatus, and substrate processing method

Component of a liquid discharge nozzle for semiconductor substrate processing apparatus

Liquid discharge nozzle for semiconductor substrate processing apparatus

A substrate processing apparatus includes a stationary cup bodyprovided to surround a substrate holding unitand configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard; and a guard elevating mechanismconfigured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portionof a cylindrical shape and a protruding portionprotruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.

Substrate processing apparatus, substrate processing method and recording medium

After a discharge of a processing liquid is stopped, a position of a liquid surface within a nozzle can be observed. A substrate processing apparatus includes a substrate holding mechanism and the nozzle. The substrate holding mechanism is configured to hold a substrate. The nozzle is configured to supply the processing liquid to the substrate. The nozzle includes a pipe member and an observation window. The pipe member has a horizontal part and a downward part extended downwards from the horizontal part, and is configured to discharge the processing liquid from a tip end of the downward part. The observation window is provided at the horizontal part of the pipe member.

Substrate processing apparatus and nozzle

According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.

Substrate processing apparatus, method of cleaning substrate processing apparatus, and storage medium

A liquid treatment apparatus includes a substrate holder () that holds a substrate horizontally and rotates the substrate, a treatment liquid nozzle () that supplies a treatment liquid to the substrate held by the substrate holder, a cup () that is arranged outside of a peripheral edge of the substrate held by the substrate holder and receives the treatment liquid which has been supplied to the substrate by the treatment liquid nozzle, a top plate () that covers the substrate held by the substrate holder from above, a top plate rotation driving mechanism that rotates the top plate, and a liquid receiving member () that surrounds a peripheral edge of the top plate and has a circular liquid receiving space ().

Liquid treatment apparatus

A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

Substrate processing apparatus

A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.

Liquid process apparatus and liquid process method

A liquid treatment apparatus includes a substrate holding member that holds a substrate horizontally, a rotation mechanism that rotates the substrate holding member; a chemical liquid nozzle that supplies a chemical liquid to the substrate held by the substrate holding member; a top plate that covers the substrate held by the substrate holding member from above the substrate; and at least one LED lamp that heats the substrate during a chemical liquid treatment by irradiating the substrate with light of a predetermined wavelength through the top plate from above the top plate.

Liquid treatment apparatus and liquid treatment method

The liquid treatment apparatus according to the present invention includes a substrate holder configured to horizontally hold a substrate, and a top plate configured to be rotatable and to cover the substrate held by the substrate holder from above so as to define a treatment space. In the treatment space, a chemical liquid is supplied by a chemical liquid nozzle onto the substrate, and an atmosphere replacement gas is supplied by a replacement nozzle into the treatment space. The replacement nozzle is supported by a replacement nozzle support arm configured to be horizontally moved between an advanced position at which the replacement nozzle support arm is advanced into the treatment space and a retracted position at which the replacement nozzle support arm is retracted outside from the treatment space. The replacement nozzle is configured to discharge, above the substrate, the atmosphere replacement gas upward.

Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a nozzle supporting arm that supports a nozzle. The liquid processing apparatus of the present disclosure includes: a processing chamber having a substrate holding unit configured to hold a substrate and a cup disposed around the substrate holding unit; a nozzle configured to supply a fluid to the substrate held by the substrate holding unit; and a nozzle supporting arm configured to support the nozzle. An arm cleaning unit configured to clean the nozzle supporting arm is installed in the liquid processing apparatus.

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Koshi, Japan

Kazuhiro Aiura