Matsushita Electric Industrial Co., Ltd.

Katsuyuki Ikenouchi

Yoshiharu Hidaka

Tomoyasu Murakami

Yuichi Miyoshi

Mamoru Kanemoto

Yasunori Fukui

Hideaki Kunitake

In a semiconductor substrate having a notch in an edge portion thereof, each of the two shoulder portions of the notch is configured as an arc and the difference in curvature between the two shoulder portions of the notch is not less than 0 mm and not more than 0.1 mm.

Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device

The substrate polishing method of the present invention can be used, in a substrate polishing apparatus having multiple carriers for one polishing pad, for determining a polishing time necessary to obtain a specific amount of polishing in polishing substrates using only some of the carriers among multiple carriers. In the present method, a correction coefficient indicating the correlation between the polishing time in polishing substrates using all the carriers and the polishing time in polishing substrates using only a part of the carriers is obtained in advance. The polishing time necessary for the specific amount of polishing in polishing substrates using only a part of the carriers is calculated based on the correction coefficient and the polishing time necessary for polishing the specific amount of polishing in polishing substrates using all of the carriers. By this, the amount of polishing of a factional number of substrates can be easily made to coincide with the amount of polishing of other substrates polished using all of the carriers.

Substrate polishing method and method of manufacturing semiconductor device

A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.

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Toyama, Japan

Katsuyuki Ikenouchi