Fujimi Incorporated

Katsuyoshi Ina

Kenji Sakai

Tadahiro Kitamura

Hiroshi Asano

Koji Ohno

Kazusei Tamai

Satoshi Suzumura

Chiyo Horikawa

Shinichiro Takami

Tsuyoshi Matsuda

Tomohide Kamiya

A polishing composition capable of satisfactorily polishing a semiconductor. The first polishing composition of the present invention includes silicon dioxide, at least one component selected from periodic acids and salts thereof, at least one component selected from tetraalkyl ammonium hydroxides and tetraalkyl ammonium chlorides, hydrochloric acid, and water, and contains substantially no iron. The second polishing composition of the present invention includes a predetermined amount of fumed silica, a predetermined amount of at least one component selected from periodic acids and salts thereof, a tetraalkyl ammonium salt represented by the following general formula (1), at least one component selected from ethylene glycol and propylene glycol, and water. The pH of the second polishing composition is greater than or equal to 1.8 and is less than 4.0. 

Polishing composition and method for forming wiring structure using the same

There is provided a polishing composition that reduces erosion and is used in a final polishing step of a semiconductor device manufacturing process. The polishing composition contains colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water and its pH is 1.8 to 4.0.

Polishing composition

A polishing composition comprising the following components (a) to (g):

Polishing composition and polishing method employing it

Polishing composition and polishing process

A process for producing a polishing composition, which comprises preliminarily adjusting water to pH 2-4, adding from 40 to 60 wt % of fumed silica to the water under high shearing force, adding water to lower the viscosity to 2-10000 cps, stirring the mixture under low shearing force for at least 5 minutes, adding water to lower the fumed silica concentration to 10-38 wt %, and adding a basic substance under vigorous stirring to raise the pH to 9-12.

Process for producing polishing composition

A polishing composition comprising the following components:

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Aichi, Japan

Katsuyoshi Ina