Tokyo Electron Limited

Katsuhiro Morikawa

Masami Akimoto

Kouichi Mizunaga

Satoshi Morita

Ikuo Sunaka

Naruaki Iida

Suguru Enokida

Seiji Nakano

Issei Ueda

Kouzou Tachibana

Masahiro Nakaharada

Akira Murata

Kazunori Kuratomi

Toshio Shimazu

Yuta Matsushima

Satoshi Kaneko

Taro Yamamoto

Mitsuaki Iwashita

Michiaki Matsushita

Junya Minamida

Seiki Ishida

Daisuke Goto

Kouzou Kawahara

Takahiro Koga

Kousuke Negishi

A substrate processing method of performing liquid processing on a substrate in a substrate processing apparatus, which includes a substrate table configured to suction the substrate, a heater configured to heat the substrate table, and a processing liquid nozzle configured to supply a processing liquid to the substrate suctioned to the substrate table, includes: a suctioning process of suctioning the substrate by the substrate table when there is no temperature difference between the substrate and the substrate table or when a temperature difference between the substrate and the substrate is within a predetermined range; and after the suctioning process, a processing liquid supply process of supplying the processing liquid from the processing liquid nozzle to the substrate suctioned to the substrate table heated by the heater.

Substrate processing method and substrate processing apparatus

A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

Substrate processing apparatus and substrate processing method

A processing liquid nozzle includes: an ultrasonic wave generator including a oscillator that generates ultrasonic waves and a oscillating body that is joined to the oscillator; a first supply flow path configured to supply a first liquid to a position in contact with the oscillating body of the ultrasonic wave generator; an ejection flow path configured to supply the first liquid to which the ultrasonic waves are applied by the ultrasonic wave generator to an ejection port; and a second supply flow path connected to the ejection flow path on a downstream side from the ultrasonic wave generator and configured to supply a second liquid to the ejection flow path.

Processing liquid nozzle and cleaning apparatus

A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.

Substrate processing apparatus with moving device for connecting and disconnecting heater electrodes and substrate processing method thereof

A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.

Substrate processing method

A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.

Substrate processing apparatus including periphery cover body

A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.

There is provided a drying apparatus for covering an upper surface of the substrate with an uneven pattern formed thereon with a liquid film and subsequently drying the substrate, including: a first heat transfer part whose temperature is adjusted to a first temperature, wherein a first heat is transferred between the first heat transfer part and the substrate by a first temperature difference; a second heat transfer part whose temperature is adjusted to a second temperature different from the first temperature, wherein a second heat is transferred between the second heat transfer part and the substrate by a second temperature difference; and a controller configured to control the first temperature and the second temperature and to control a surface tension distribution of the liquid film so as to control an agglomeration of the liquid film.

Drying apparatus, substrate processing system, and drying method

A substrate processing apparatus includes a rotary table configured to hold and rotate a substrate; an electronic component provided at the rotary table and configured to be rotated along with the rotary table; a first electrode unit provided at the rotary table and configured to be rotated along with the rotary table, the first electrode unit comprising multiple first electrodes electrically connected to the electronic component via multiple first conductive lines; an electric device configured to perform a power supply to the electronic component and a transmission/reception of signals; a second electrode unit comprising multiple second electrodes electrically connected to the electric device via multiple second conductive lines and arranged at positions respectively corresponding to the multiple first electrodes to be brought into contact with the multiple first electrodes; and an electrode moving device configured to connect/disconnect the first electrode unit to/from the second electrode unit.

Substrate processing apparatus

Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.

Substrate transfer device and substrate transfer method

A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.

A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.

A substrate transfer method is provided. The substrate transfer method comprises: loading the transfer container to a load port, and separating the cover body from the container main body; detecting an accommodation status of the substrate in the container main body by a detection unit; correcting, by a correction device, the accommodation status of the substrate in the container main body in which the accommodation status of the substrate detected by the detection unit is abnormal; and allowing a substrate transfer device to enter the container main body in which the accommodation status of the substrate is corrected, and unloading the substrate from the container main body.

Substrate transfer method and storage medium

A substrate processing apparatus includes: first and second places in which a substrate can be placed; a substrate transfer device having a substrate holder that holds the substrate to transfer the substrate between the first and second places; and a substrate position measuring unit that detects a position of the substrate held by the substrate holder. The substrate position measuring unit, disposed independently of the substrate transfer device, is arranged at a position where the substrate held by the substrate holder of the substrate transfer device can be placed.

Growing community of inventors

Koshi, Japan

Katsuhiro Morikawa