Ebara Corporation

Other

Kabushiki Kaisha Toshiba

Katsuhiko Tokushige

Norio Kimura

Manabu Tsujimura

Hisanori Matsuo

Hideo Aizawa

Kenji Kamimura

Makoto Akagi

Satoshi Okamura

Hiroshi Tomita

Naoto Miyashita

Masako Kodera

Soichi Nadahara

Mitsuhiko Shirakashi

Yoshitaka Matsui

Masao Asami

Mitsuru Miyazaki

Junji Kunisawa

Katsuhide Watanabe

Masayoshi Imai

Takeshi Iizumi

Suguru Ogura

A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.

Substrate processing apparatus and substrate processing method

The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.

Polishing apparatus

A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Polishing method and apparatus

The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Growing community of inventors

Tokyo, Japan

Katsuhiko Tokushige