Infineon Technologies Sc300 Gmbh & Co., Kg

Motorola Corporation

Katrin Ebner

Walter Glashauser

Lutz Teichgr&auml;ber

David Haggart

David Erdmann

Lutz Teichgräber

By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.

Configuration and method for mounting a backing film to a polish head

A polish head for Chemical Mechanical Polishing includes a backing film of silicone on a rigid support element, preferably, of amorphous ceramic. The silicone backing film is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The head provides a uniform polishing of a semiconductor wafer.

Configuration for polishing disk-shaped objects

A polishing head ( ) for a chemical-mechanical polishing machine that holds a semiconductor wafer ( ) against a polishing pad ( ) has a chuck ( ) with a pressure chamber ( ) to apply a down force substantially equally to the wafer backside ( ). An electrode arrangement ( ) within the chamber ( ) is located coplanar to the wafer ( ) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities.

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Dresden, Germany

Katrin Ebner