Industrial Technology Research Institute

Kang-Feng Lee

Chih-Yung Huang

Ching-Chiun Wang

Jen-Rong Huang

Ruey-Liang Ma

Yuan-Heng Sun

Jen-Yu Yu

Feng-Yu Tsai

Yi-Tsung Pan

Shih-Chin Lin

Meng-Ru Lin

Ming Horn Zheng

Yuan-Ann Chang

A transfer method for expanding pitches of devices includes: providing a first substrate with micro devices having the pitches being a predetermined value in a first direction and a second direction; transferring the micro devices to a first roller by contacting it with the micro devices, wherein a pitch of contact line portions on the first roller is N times of the predetermined value; transferring the micro devices on the first roller to a second substrate; rotating the second substrate by 90 degrees; transferring the micro devices to a second roller by rolling the second roller to contact the micro devices; and then transferring the micro devices to a third substrate to expand the pitch of the micro devices in both the first and the second directions. The portions in contact with the micro devices all have adhesive layers with different adhesion operation windows.

Transfer method of expanding pitches of device and an apparatus for performing the same

A multi-diameter clamp for clamping on tires of different sizes is provided. The multi-diameter clamp comprises at least one clamping unit, at least one actuator, and at least one sensing unit. The at least one clamping unit further includes at least one movable member and a fixed member. Wherein the at least one movable member moves within a tire housing space having a starting position and a clamping position. The tire housing space locates between the movable member and the fixed member for clamping on a tire. The at least one actuator connects to the at least one movable member, and enables the at least one moveable member to move between the starting position and the clamping position. The at least a sensing unit obtains a diameter size of the tire, and based on the diameter size, actuates the at least one actuator corresponding to the diameter size.

Multi-diameter clamp for clamping on tires of different sizes

Disclosed is an encapsulation film. An inorganic oxide film is formed on an organic sealing layer by an atomic layer deposition (ALD) to form the encapsulation film, wherein the organic sealing layer is a polymer containing hydrophilic groups. The organic sealing layer and the inorganic oxide layer have covalent bondings therebetween. The encapsulation film can solve the moisture absorption problem of conventional organic sealing layers, thereby being suitable for use as a package of optoelectronic devices.

Encapsulation film, package structure utilizing the same, and method for forming the package structure

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Taipei, Taiwan

Kang-Feng Lee