Intel Corporation

Kaizad Rumy Mistry

Tahir Ghani

Robert S Chau

Anand S Murthy

Mark T Bohr

Stephen M Cea

Kelin J Kuhn

Christopher P Auth

Sairam Agraharam

Mark Armstrong

Ian R Post

Chris Auth

Martin Spence Denham

Xavier Francois Brun

Rachael Jade Parker

Nisha Ananthakrishnan

Wenliang Chen

Mohsen Alavi

Paul R Start

Justin S Sandford

Liwei Wang

Patrick John Ott

Yawei Liang

Paul Gregory Slankard

Jigneshkumar P Patel

Keith c/o Intel Corporation Zawadzki

Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.

Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control

A process is described for manufacturing an improved PMOS semiconductor transistor. Recesses are etched into a layer of epitaxial silicon. Source and drain films are deposited in the recesses. The source and drain films are made of an alloy of silicon and germanium. The alloy is epitaxially deposited on the layer of silicon. The alloy thus has a lattice having the same structure as the structure of the lattice of the layer of silicon. However, due to the inclusion of the germanium, the lattice of the alloy has a larger spacing than the spacing of the lattice of the layer of silicon. The larger spacing creates a stress in a channel of the transistor between the source and drain films. The stress increases Iand Iof the transistor. An NMOS transistor can be manufactured in a similar manner by including carbon instead of germanium, thereby creating a tensile stress.

Semiconductor transistor having a stressed channel

Methods of fabricating a first contact to a semiconductor device, which fundamentally comprises providing a semiconductor device formed on a substrate. The substrate further includes a conductive surface. A dielectric layer is formed over the substrate and has an opening exposing the conductive surface. The opening extends an entire length of the semiconductor device, partway down the entire length of the device, extending from the device onto adjacent field of the device, or and a combination thereof. A barrier layer is formed within the opening. A copper containing material fills the opening to form a first contact to the semiconductor device.

Copper-filled trench contact for transistor performance improvement

A method for processing dual threshold nMOSFETs and pMOSFETs requiring only one additional masking and implantation operation over single threshold MOSFETs is disclosed. The additional mask and implant operation both enhances the threshold voltage doping of one type of FET and compensates the threshold voltage doping of another type of FET. Where a first threshold voltage implant sets the threshold voltage for an NMOS device to a low threshold voltage, and a second threshold voltage implant sets the threshold voltage for a PMOS device to a high threshold voltage, a third implant may both enhance a NMOS device threshold implant to set the threshold voltage high while compensating a PMOS device threshold implant to set the threshold voltage low.

Method of fabricating MOSFET transistors with multiple threshold voltages by halo compensation and masks

Field effect transistor structures include a channel region formed in a recessed portion of a substrate. The recessed channel portion permits the use of relatively thicker source/drain regions thereby providing lower source/drain extension resistivity while maintaining the physical separation needed to overcome various short channel effects. The surface of the recessed channel portion may be of a rectangular, polygonal, or curvilinear shape. In a further aspect of the present invention, transistors are manufactured by a process in which a damascene layer is patterned, the channel region is recessed by etch that is self-aligned to the patterned damascene layer, and the gate electrode is formed by depositing a material over the channel region and patterned damascene layer, polishing off the excess gate electrode material and removing the damascene layer.

Field effect transistor structure with self-aligned raised source/drain extensions

A fuse-based cell. The fuse-based cell includes a fuse with a programming device electrically coupled to the fuse to program the fuse. A sensing device is electrically coupled to the fuse to sense a programming state of the fuse. A clamping device is electrically coupled to the sensing device to control voltages across the sensing device during programming. A pass device is electrically coupled to the sensing device to control voltages across the sensing device during sensing.

Static, low-voltage fuse-based cell with high-voltage programming

A method of forming an MOS integrated circuit having at least two types of NFET, each type having a different threshold voltage, and at least two types of PFET, each type having a different threshold voltage, includes forming at least four active regions in a substrate, each region having a different doping profile. A conventional two threshold voltage CMOS process is modified to produce four transistor threshold voltages with only one additional masked implant operation. This additional implant raises the threshold voltage of one type of MOSFET while lowering that of the other MOSFET type.

Method of fabricating dual threshold voltage n-channel and p-channel mosfets with a single extra masked implant operation

An apparatus including a MOSFET circuit having dual threshold voltage NMOS and PMOS transistors wherein the threshold voltage of a low threshold NMOS transistor is set with a first halo implant, a threshold voltage of a high threshold voltage PMOS transistor is set with a second halo implant, and, a threshold voltage of a high threshold voltage NMOS transistor is enhanced while, a threshold voltage of a low threshold voltage PMOS transistor is compensated with a third halo implant.

Method of fabricating dual threshold voltage n-channel and p-channel MOSFETS with a single extra masked implant operation

A process is described for manufacturing an improved PMOS semiconductor transistor. Recesses are etched into a layer of epitaxial silicon. Source and drain films are deposited in the recesses. The source and drain films are made of an alloy of silicon and germanium. The alloy is epitaxially deposited on the layer of silicon. The alloy thus has a lattice having the same structure as the structure of the lattice of the layer of silicon. However, due to the inclusion of the germanium, the lattice of the alloy has a larger spacing than the spacing of the lattice of the layer of silicon. The larger spacing creates a stress in a channel of the transistor between the source and drain films. The stress increases I and I of the transistor. An NMOS transistor can be manufactured in a similar manner by including carbon instead of germanium, thereby creating a tensile stress.

Growing community of inventors

Lake Oswego, OR, United States of America

Kaizad Rumy Mistry