Applied Materials, Inc.

Kadthala Ramaya Narendrnath

Shamouil Shamouilian

Ananda H Kumar

Ashish Bhatnagar

Dennis Stanley Grimard

Arnold Kholodenko

Alexander M Veytser

Govinda Raj

Semyon L Kats

Young Jeen Paik

Surinder S Bedi

Edwin Charles Weldon

Kenneth S Collins

Vijay D Parkhe

Yongqi Hu

You Wang

Wing Lau Cheng

Gangadhar Sheelavant

Bopanna Ichettira Vasantha

Dan Maydan

Simon Yavelberg

Brian C Lue

Robert J Steger

Timothy S Dyer

Robert Hirahara

Arik Donde

Thomas Lawrence Terry

Monika Agarwal

Umesh M Kelkar

Goichi Yoshidome

Daniel Martin

Dmitry Lubomirsky

Michael Robert Rice

David P Thompson

Robert Jan Visser

Muhammad M Rasheed

Hamid Noorbakhsh

Huixiong Dai

Xinglong Chen

Cheng-Hsiung Matt Tsai

Lin Zhang

Paul E Luscher

Laxman Murugesh

Manjunatha P Koppa

Syed Hasan Askari

Sudhir R Gondhalekar

Tony Kaushal

Patrick M Martin

Timothy B Michaelson

Gerhard M Schneider

Liang-Guo Wang

Jingjing Xu

Christopher Richard Mahon

Ross Marshall

Hamid Mohiuddin

Michael Douglas

Eric Farahmand E Askarinam

Bopanna Vasanth

Prashanth Rao

An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

Carrier head membrane with regions of different roughness

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

Window in thin polishing pad

Method of making carrier head membrane with regions of different roughness

A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

3D printed chamber components configured for lower film stress and lower operating temperature

An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.

Edge ring for a substrate processing chamber

An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.

Electrostatic chuck optimized for refurbishment

A laminated top plate of a workpiece carrier is described that is particularly suitable for mechanical and semiconductor processing. In one example, A method of fabricating a workpiece carrier top plate includes dispensing conductive paste onto at least one of a plurality of ceramic sheets, embedding the paste between the plurality of ceramic sheets, compacting ceramic sheets together with the paste, and sintering the paste.

Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing

A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (R) of less than about 30 microinches (&#x3bc;in).

Retaining ring for lower wafer defects

Method of placing window in thin polishing pad

An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.

Thermal radiation barrier for substrate processing chamber components

Carrier head membrane roughness to control polishing rate

Growing community of inventors

San Jose, CA, United States of America

Kadthala Ramaya Narendrnath