Samsung Electronics Co., Ltd.

K S Ravindhran

Ephraim Suhir

Peter V Schwartz

Roger L Kroeze

One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.

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Stockton, CA, United States of America

K S Ravindhran