Infineon Technologies Ag

Jörg Rottstegge

Michael Sebald

Christian Eschbaumer

Christoph Hohle

Gertrud Falk

Waltraud Herbst

Eberhard Kühn

Ernst-Christian Richter

Wolf-Dieter Domke

Kerstin Seibold

Siew Siew Yip

Marion Kern

A photoresist contains a polymer that has no silicon-containing groups. Consequently, no expulsion of silicon-containing compounds in gaseous form occurs on exposure to short-wave radiation. The polymer is obtained by terpolymerization of a first comonomer having a group cleavable under acid catalysis, a second comonomer having an anchor group, and a monounsaturated hydrocarbon, in which individual carbon atoms of the carbon skeleton may also be replaced by oxygen, as a third comonomer. The polymer has a low glass transition temperature, and the photoresist therefore has a good layer quality on film formation and good structurability.

Resist for photolithography having reactive groups for subsequent modification of the resist structures

Structured resists are consolidated, that is post-exposure amplified. The amplifying agent used is a compound which contains at least one bicyclic or polycyclic group. The amplifying agent is attached via a reactive group to a reactive anchor group of a polymer that is used for the resist. The process is particularly suitable for amplifying copolymers of cycloolefins and maleic anhydride.

Chemical consolidation of photoresists in the UV range

A photoresist includes a polymer having a main chain composed of alternating silicon and oxygen atoms and a polymer chain segment which linked as a side chain to the main chain and whose chain is composed of carbon atoms. The chain composed of carbon atoms includes acid-labile groups, so that the photoresist according to the invention can be constructed as a chemically amplified photoresist.

Silicon-containing resist for photolithography

A process amplifies structured resists by utilizing a reaction between a nucleophilic group and an isocyanate group or thiocyanate group to link an amplification agent to a polymer present in the photoresist. The amplification agent includes aromatic and/or cycloaliphatic groups. An isocyanate group or a thiocyanate group and a nucleophilic group form a reaction pair; one of the partners is provided on the polymer and the other partner on the amplification agent. The amplification reaction takes place more rapidly than a linkage to carboxylic anhydride groups. Furthermore, the amplification reaction permits the use of polymers which have high transparency at short wavelengths of less than 200 nm, in particular 157 nm.

Process for structuring a photoresist by UV at less than 160 NM and then aromatic and/or alicyclic amplification

A photoresist includes a polymer which has acid-cleavable groups in its main chain. The polymer can thus be cleaved by acid into short cleavage products which can be removed from the substrate through the use of a developer. The polymer is completely or partially fluorinated, and consequently has an improved transparency to light of short wavelengths.

Photoresist based on polycondensates and having an increased resolution for use in 157 nanometer lithography

The chemically amplified resist includes a film-forming polymer, a photoacid generator, and a solvent. The film-forming polymer contains acid-labile groups which are eliminated under the action of an acid and liberate a group which brings about an increase in the solubility of the polymer in aqueous alkaline developers. The film-forming polymer has polymer building blocks derived from monomers which are at least monofluorinated and contain an anchor group for the attachment of an amplifying agent. As a result of the fluorination of the polymer building blocks, the transparency of the resist at an exposing wavelength of 157 nm is substantially increased, so that resist structures of increased layer thickness can be represented.

Photoresists with reaction anchors for chemical consolidation of resist structures for exposures at 157 nm

The invention relates to a process for amplifying structured resists. The process permits a subsequent increase in the etch resistance and a change in the structure size of the resist even in the case of ultrathin layers. The chemical amplification is carried out in a solvent that is so nonpolar that it does not dissolve the structured resist or dissolves it only to an insignificant extent. Because of the lower surface tension of these solvents, the danger of a collapse of these structures is additionally avoided.

Process for increasing the etch resistance and for reducing the hole and trench width of a photoresist structure using solvent systems of low polarity

A process for producing amplified negative resist structures that includes exposing and contrasting of a resist then simultaneously developing and amplifying the resist to form the amplified resist structures. This substantially simplifies the production of amplified resist structures. Amplifying agents used include bicyclic or polycyclic compounds containing at least one reactive group for attachment to the resist polymer.

Negative resist process with simultaneous development and chemical consolidation of resist structures

A chemically amplified photo-resist includes a polymer containing acid-labile radicals attached to a polar group and also contains anchor groups that allow attachment of a consolidating agent. The polymer includes first repeating units containing siloxane groups. The photoresist on the one hand exhibits an enhanced transparency for short-wavelength radiation and on the other hand permits chemical consolidation of the structured resist. A process for producing structured resists is a also described.

Silicon resist for photolithography at short exposure wavelengths and process for making photoresists

The invention relates to a process for producing amplified negative resist structures in which, following exposure and contrasting of the resist, the resist structure is simultaneously developed and aromatized. This substantially simplifies the production of amplified resist structures. Amplifying agents include compounds having not only a reactive group for attachment to an anchor group of the polymer, but also at least one aromatic group.

Negative resist process with simultaneous development and aromatization of resist structures

A process for chemically amplifying structured resists includes applying a chemically amplified resist to a substrate and structuring it in a customary manner. Preferably, the amplification agent is applied in an aqueous phase to the structured resist and, after chemical amplification is complete, excess agent is removed by an aqueous wash medium. By using water as a solvent for the amplification agent and as a wash medium, it is possible to avoid organic solvents that constitute an explosion hazard. Furthermore, removal of partially exposed resist sections is suppressed.

Process for modifying resist structures and resist films from the aqueous phase

The novel process lends itself to the production of highly resolved resist structures. A resist structure having webs is produced from a photoresist on a substrate and then the sidewalls of the webs are selectively chemically amplified so that chemically amplified sidewall structures are obtained. After the removal of the chemically unamplified sections, the amplified sidewall structures are transferred to the substrate. The process permits a resolution of structures that are not producible using the currently customary exposure wavelengths.

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Lilienthal, Germany

Jörg Rottstegge