Central Glass Company, Limited

Junya Nakatsuji

Kazuhiro Yamanaka

Tsuyoshi Ogawa

Makoto Matsuura

Hiroshi H Eguchi

Masafumi Oda

Katsuhiro Akiyama

Takeshi Suda

Makoto Seino

Yutaka Sugita

Wataru Kawai

Yu Matsuno

Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula: [(R)RSiO] and a solvent. In the formula, Ris a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); Ris each independently a hydrogen atom, a C-Calkyl group, a phenyl group, a hydroxy group, a C-Calkoxy group or a C-Cfluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied.

Silicon-containing layer-forming composition, and method for producing pattern-equipped substrate which uses same

Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula and a solvent. [(R)RSiO] In the formula, Ris a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); Ris each independently a hydrogen atom, a C-Calkyl group, a phenyl group, a hydroxy group, a C-Calkoxy group or a C-Cfluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied).

Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO, CH, CO, C(CH), C(CH)(CHCH), C(CF), C(CH)(CH), CH&#x2014;CH&#x2014;CHor a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphtharene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1&#x2264;a+b&#x2264;4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Fluorine-containing polymerizable monomer and polymer compound using same

A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent[(R)RSiO]&#x2003;&#x2003;(1)where Rrepresents the following group; Reach represents a hydrogen atom, C-Calkyl group, phenyl group, hydroxy group, C-Calkoxy group or C-Cfluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Positive photosensitive resin composition, method for producing film using same, and electronic component

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25&#xb0; C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Curable resin composition, cured product thereof, and semiconductor device using the same

Silane composition and cured film thereof, and method for forming negative resist pattern using same

Disclosed in the present invention are a fluorine-containing polymerizable compound of the general formula (1) and a polymer compound obtained therefrom: where A represents a single bond, an oxygen atom, a sulfur atom, SO, CH, CO, C(CH), C(CH)(CHCH), C(CF), C(CH)(CH), CH&#x2014;CH&#x2014;CHor a divalent organic group obtained by elimination of two hydrogen atoms from benzene, biphenyl, naphthalene, cyclohexene or fluorene; and a and b each independently represent an integer of 0 to 2 and satisfy a relationship of 1&#x2266;a+b&#x2266;4. The thus-obtained polymer compound combines adequate hydrophilicity and high transparency with low water adsorption of fluorine-containing compound.

Disclosed is a curable composition including a silicone (A) of a specific structure and a composition containing Si&#x2014;OH group and Si&#x2014;H group, a silicone (B) of a specific structure and a composition containing Si&#x2014;OH group and Si&#x2014;CH&#x2550;CHgroup, and a hydrosilylation catalyst of a catalytic quantity containing at least one metal compound selected from the group consisting of platinum compounds, palladium compounds, and rhodium compounds. In this curable composition, as kind of each silicone and the content of Si&#x2014;OH group are adjusted, in curing the silicone, foaming in a cured product can be inhibited by inhibiting a dehydration condensation reaction between Si&#x2014;OH groups, as compared with a hydrosilylation reaction which is a reaction of Si&#x2014;CH&#x2550;CHgroup and Si&#x2014;H group. Furthermore, an excellent adhesion to a base body such as semiconductor substrate can be given when making a cured film.

Curable composition containing silicone, and cured product thereof

Disclosed is a novolak resin containing a repeating unit represented by the general formula (1). Ris a hydrogen atom or an alkyl group which is Cstraight-chain or Cbranched-chain, and some or all hydrogen atoms in the alkyl group may be replaced with a fluorine atom; Ris a hydrogen atom, a phenyl group, an alkyl group which is Cstraight-chain or Cbranched-chain, or an alkyl group having a Ccyclic structure, and some or all hydrogen atoms in the phenyl group and the alkyl group may be replaced with fluorine atoms; each of a and b is independently an integer of 1-3, and these are defined as 2&#x2266;a+b&#x2266;4; and d is an integer of 0-2. This novolak resin has high dissolution rate in the alkaline development solution in addition to the heat resisting property which is a property of phenolic resin. 

Novolak resin containing hexafluoroisopropanol group, method for producing same, and composition of same

A composition containing a metal compound and a siloxane compound (A) represented by general formula (1): wherein X is represented by general formula X1 or X2: wherein the number of X1 is 1-8; the number of X2 is 0-7; the sum of the number of X1 and the number of X2 is 8; Rto Rrepresent a hydrogen atom, a Calkyl group, alkenyl group, alkynyl group, or a Caryl group, a hydrogen atom thereof optionally being substituted by a fluorine atom; Rrepresents a Calkyl group, alkenyl group, alkynyl group or aryl group, a hydrogen atom thereof being optionally substituted by a fluorine atom, a carbon atom being optionally substituted by an oxygen atom or a nitrogen atom; Rrepresents a hydrogen atom, a vinyl group or an allyl group; m and n represent an integer of 1-4; and 3&#x2266;m+n.

Siloxane-based composition and cured product thereof, and use therefor

Disclosed is a fluorine-containing aromatic compound represented by the following general formula (1) and its production method. In the formula (1), Ris a hydroxyl group or amino group, each of Rto Ris independently a hydrogen atom, or a Cstraight chain or a Cor Cbranched chain alkyl group, hydrogen atoms of the alkyl group may partially or totally be replaced with fluorine atoms, n is an integer of 0 to 2, and each of m and l is independently 0 or 1. A polymer derived from this fluorine-containing aromatic compound contains &#x2014;C(CF)OH group at a position away from the polymer main chain. Therefore, it is useful for resist use. 

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Fujimino, Japan

Junya Nakatsuji