Multiplanar Technologies Incorporated

Junsheng Yang

Jiro Kajiwara

Gerard Moloney

Jun Liu

Huey-Ming Wang

Alejandro Reyes

Cormac Walsh

Ernesto Saldana

A system () and method for polishing and planarizing a substrate () is provided that reduces non-uniformities in the removal of material from the edge of the substrate due to a rebound effect. In one embodiment system () includes a polishing head () having a carrier (), a subcarrier () carried by the carrier and adapted to hold the substrate during a polishing operation, and a retaining ring () having an inner edge () disposed about the subcarrier. A lower surface () of the retaining ring () is in contact with a polishing surface () during the polishing operation, and has at least one annular recess () formed therein to enable the polishing surface compressed under the retaining ring to rebound into the annular recess, thereby reducing the rebound effect and inhibiting non-planar polishing of the surface of the substrate ().

Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface

A polishing apparatus () is provided for polishing a substrate () that has slurry distributor () which improves planarization uniformity. Generally, the apparatus () includes: (i) a platen () with a polishing surface (); (ii) a head () adapted to hold the substrate () against the polishing surface; (iii) a mechanism to rotate the platen () during polishing; (iv) a dispenser () having nozzles () to dispense slurry on the surface (); and (v) a distributor () between the nozzles () and the head (). In one embodiment, the apparatus () further includes a wiper () between the head () and the distributor () to remove used slurry and polishing byproducts from the surface (), thereby reducing agglomerations or deposits that can damage the substrate () and improving yield. Optionally, the apparatus () further includes a dispenser () for dispensing a cleaning fluid before and/or after the wiper () to substantially eliminate buildup of deposits.

Slurry distributor for chemical mechanical polishing apparatus and method of using the same

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Sunnyvale, CA, United States of America

Junsheng Yang