Samsung Electronics Co., Ltd.

Jung-dal Choi

Sang-Su Kim

Kwang-Soo Seol

Seung-Jae Jung

Youn-Seon Kang

Kyong-moo Mang

Joon-Hee Lee

Jang-Gn Yun

Dong-Hoon Jang

Jae-Hwan Lee

Byung-Kwan You

Tae-yong Kwon

Dong-kyu Lee

Seong-Min Jo

Seung-Woo Paek

Sok-Won Lee

Chang-Hyun Lee

Choong-Ho Lee

Jae-Goo Lee

Young-Woo Park

Sung-Hoi Hur

Chang-seok Kang

Keon-Soo Kim

Dong-Jun Kim

Seok-Won Lee

Sung-Il Chang

Seung-Pil Chung

Ju-Hyung Kim

Chang-Hyun Cho

Jung-Gil Yang

Eun-ae Chung

Gab-Jin Nam

Toshiro Nakanishi

Dong-Jun Seong

Suk-Kang Sung

Jung-Moo Lee

Jin-hyun Shin

Chung-Il Hyun

Yoon-Moon Park

Se-Jun Park

Chang-hyun Lee

Yong-lack Choi

Byung-Kyu Cho

Guangfan Jiao

Byeung-chul Kim

Young-Seop Rah

Chang-Jae Yang

Sung-bu Jun

Seung-Wook Choi

Dong-soo Jang

Yu-bin Kim

Jee-Yeon Kang

Do-Hyun Lee

Hyun-seok Jang

Du-heon Song

A semiconductor device includes a substrate having a logic device region including logic devices thereon, and an input/output (I/O) device region including I/O devices thereon adjacent the logic device region. A first fin field-effect transistor (FinFET) on the logic device region includes a first semiconductor fin protruding from the substrate, and a triple-gate structure having a first gate dielectric layer and a first gate electrode thereon. A second FinFET on the I/O device region includes a second semiconductor fin protruding from the substrate, and a double-gate structure having a second gate dielectric layer and a second gate electrode thereon. The first and second gate dielectric layers have different thicknesses. Related devices and fabrication methods are also discussed.

Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device

A resistive memory device includes a plurality of memory cell pillars arranged in a line in one direction and each having a memory layer and a top electrode layer connected to the memory layer, a top conductive line having a plurality of protrusions extending downwardly and between which pockets in the bottom of the top conductive line are defined, and a plurality of insulating pillars. The protrusions of the top conductive line face and are electrically connected to the memory cell pillars, respectively, so as to be electrically connected to the memory layer through the top electrode layer of the memory cell pillar. The insulating pillars extend from insulating spaces, between side wall surfaces of the memory layers and top electrode layers of the memory cell pillars, into the pockets in the bottom of the top conductive line.

Resistive memory device and method of operating resistive memory device

A semiconductor device includes a substrate, a compound semiconductor layer, and first and second semiconductor patterns. The substrate includes first and second regions. The first semiconductor pattern is on the compound semiconductor layer of the first region and includes an element semiconductor. The second semiconductor pattern is on the compound semiconductor layer of the second region and includes a Group III-V semiconductor material.

Semiconductor device and method for fabricating the same

A semiconductor device includes a substrate, a strain-relaxed buffer layer on the substrate, at least one well in the strain-relaxed buffer layer, a first channel layer on the strain-relaxed buffer layer, and a second channel layer on the well. A lattice constant of material constituting the first well is less than a lattice constant of the material constituting the strain-relaxed buffer layer, but a lattice constant of material constituting the second well is greater than the lattice constant of the material constituting the strain-relaxed buffer layer.

Semiconductor device having strain-relaxed buffer layer and method of manufacturing the same

A fin field effect transistor includes a first fin structure and a second fin structures both protruding from a substrate, first and second gate electrodes on the first and second fin structures, respectively, and a gate dielectric layer between each of the first and second fin structures and the first and second gate electrodes, respectively. Each of the first and second fin structures includes a buffer pattern on the substrate, a channel pattern on the buffer pattern, and an etch stop pattern provided between the channel pattern and the substrate. The etch stop pattern includes a material having an etch resistivity greater than that of the buffer pattern.

Fin field effect transistor, semiconductor device including the same and method of forming the semiconductor device

A variable resistance memory device includes a plurality of first conductive lines, a plurality of second conductive lines, a plurality of memory cells, a plurality of first air gaps and a plurality of second air gaps. The first conductive line extends in a first direction. The second conductive line is over the first conductive line and extends in a second direction crossing the first direction. The memory cell includes a variable resistance device. The memory cell is located at an intersection region of the first conductive line and the second conductive line. The first air gap extends in the first direction between the memory cells. The second air gap extends in the second direction between the memory cells.

Variable resistance memory devices

A variable resistance memory device, and methods of manufacturing the same, include a plurality of first conductive structures extending in a first direction, a plurality of second conductive structures extending in a second direction crossing the first direction over the first conductive structures, the second conductive structures, and a plurality of memory cells that are formed at intersections at which the first conductive structures and the second conductive structures overlap each other, and each includes a selection element and a variable resistance element sequentially stacked. An upper surface of each of the first conductive structures has a width in the second direction less than a width of a bottom surface of each of the selection elements.

Variable resistance memory devices and methods of manufacturing the same

A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Non-volatile memory devices including blocking insulation patterns with sub-layers having different energy band gaps

Conductive line structures, and methods of forming the same, include first and second pattern structures, insulation layer patterns and an insulating interlayer. The first pattern structure includes a conductive line pattern and a hard mask stacked, and extends in a first direction. The second pattern structure includes a second conductive line pattern and another hard mask stacked, and at least a portion of the pattern structure extends in the first direction. The insulation layer patterns contact end portions of the pattern structures. The first pattern structure and an insulation layer pattern form a closed curve shape in plan view, and the second pattern structure and another insulation layer pattern form another closed curve shape in plan view. The insulating interlayer covers upper portions of the pattern structures and the insulation layer patterns, an air gap between the pattern structures, and another air gap between the insulation layer patterns.

Conductive line structures and methods of forming the same

In a method of manufacturing a semiconductor device, a dielectric layer structure and a control gate layer can be formed sequentially on a substrate. The control gate layer can be partially etched to form a plurality of control gates. A gate spacer and a sacrificial spacer sequentially can be stacked on a sidewall of the control gate and on a portion of the dielectric layer structure. The dielectric layer structure can be partially etched using the sacrificial spacer and the gate spacer as an etching mask to form a plurality of dielectric layer structure patterns. The sacrificial spacer can be removed. An insulating interlayer can be formed on the substrate to form an air gap. The insulating interlayer can cover the dielectric layer structure pattern, the gate spacer and the control gate. The air gap can extend between the adjacent gate spacers and between the adjacent dielectric layer structure patterns.

Semiconductor devices and methods of manufacturing the same

In method of programming a nonvolatile memory device including first and second cell strings that are coupled to one bitline, a first channel of the first cell string and a second channel of the second cell string are precharged by applying a first voltage to the bitline, one cell string is selected from the first and second cell strings, and a memory cell included in the selected cell string is programmed by applying a second voltage greater than a ground voltage and less than the first voltage to the bitline.

Method of programming a nonvolatile memory device

A semiconductor device includes a bit line, a first cell string and a second cell string. The first cell string includes a first selecting transistor connected to the bit line in series and having a threshold voltage greater than a first reference voltage, a second selecting transistor having a threshold voltage smaller than a second reference voltage, cell transistors and a ground selecting transistor. The second cell string includes a third selecting transistor connected to the bit line in series and having a threshold voltage smaller than the first reference voltage, a fourth selecting transistor having a threshold voltage greater than the second reference voltage, cell transistors and a ground selecting transistor. A channel region of the first selecting transistor has an enhancement mode and a first conductive type. A channel region of the third selecting transistor has a depletion mode and a second conductive type.

Semiconductor memory devices and methods of manufacturing the same

A memory device includes a substrate, a semiconductor column extending perpendicularly from the substrate and a plurality of spaced-apart charge storage cells disposed along a sidewall of the semiconductor column. Each of the storage cells includes a tunneling insulating layer disposed on the sidewall of the semiconductor column, a polymer layer disposed on the tunneling insulating layer, a plurality of quantum dots disposed on or in the polymer layer and a blocking insulating layer disposed on the polymer layer.

Vertical memory devices with quantum-dot charge storage cells

A gate structure of a non-volatile memory device and a method of forming the same including a tunnel oxide layer pattern, a charge trap layer pattern, a blocking dielectric layer pattern having the uppermost layer including a material having a first dielectric constant greater than that of a material included in the tunnel oxide layer pattern, and first and second conductive layer patterns. The gate structure includes a first spacer to cover at least the sidewall of the second conductive layer pattern. The gate structure includes a second spacer covering the sidewall of the first spacer and the sidewall of the first conductive layer pattern and including a material having a second dielectric constant equal to or greater than the first dielectric constant. In the non-volatile memory device including the gate structure, erase saturation caused by back tunneling is reduced.

Gate structure in non-volatile memory device

In one embodiment, first and second pattern structures respectively include first and second conductive line patterns and first and second hard masks sequentially stacked, and at least portions thereof extends in a first direction. The insulation layer patterns contact end portions of the first and second pattern structures. The first pattern structure and a first insulation layer pattern of the insulation layer patterns form a first closed curve shape in plan view, and the second pattern structure and a second insulation layer pattern of the insulation layer patterns form a second closed curve shape in plan view. The insulating interlayer covers upper portions of the first and second pattern structures and the insulation layer patterns, a first air gap between the first and second pattern structures, and a second air gap between the insulation layer patterns.

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Hwaseong-si, South Korea

Jung-dal Choi