Omron Corporation

Jun Kuriyama

Teruhisa Yotsuya

Kiyoshi Murakami

Masato Ishiba

Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.

Methods of and apparatus for inspecting substrate

A target object has its surface condition inspected by having its image taken from above while being irradiated by red, green and blue light beams at different elevation angles. An inspection area is set on the image and a direction is extracted on the image in which a change appears in the color phase according to the arrangement of the light sources and this extracted direction is compared with a preliminarily registered standard direction to judge the surface condition from the result of this comparison.

Apparatus for surface inspection and method and apparatus for inspecting substrate

For generating an image for inspection of a substrate, a camera is provided above this substrate with an optical axis orienting downward and a plurality of multi-colored light emitting members are set around the optical axis of the camera so as to be within a specified angular range with respect to a target area on the substrate. The camera is operated to generate an image of the target area for inspection while switched-on conditions of these light emitting members are being controlled such that the colors and angles of light illuminating this target area are varied according to a specified kind of the purpose of this inspection.

Method of generating image and illumination device for inspecting substrate

On a production line for component mounting substrate, mutually communicating inspection apparatus are each provided to a different one of production processes that are carried out sequentially such as the solder printing, component mounting and soldering processes. Each inspection apparatus can generate an X-ray transmission image of the substrate. Each inspection apparatus on the downstream side inputs an image from another inspection apparatus on the upstream side and generates a differential image of the inputted image and an X-ray transmission image of the same substrate generated by itself after the production process associated with itself is carried out. The differential image thus generated is used for inspecting the substrate such that the effect of the associated production process can be more accurately inspected.

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Fukuchiyama, Japan

Jun Kuriyama