Speedfam Corporation

Speedfam-ipec Corporation

Speedram Corporation

Joseph V Cesna

Inki Kim

Lawrence O Day

Chris E Karlsrud

Clinton O Fruitman

Anthony G Van Woerkom

Gordon J Grosslight

Spencer Preston

Philbin Scott

An apparatus for the improved polishing or planarizing of workpiece surfaces which includes polishing pad with a plurality of self-cleaning and anti-tracking grooves along the surface of the pad. The self-cleaning grooves uniformly guide slurry and polishing debris radially outward across the surface of the pad while the anti-tracking capability acts to passively reduce the creation of localized wear zones into the polishing surface. Preferably, the grooves define a concentric pattern upon the surface of the pad and have a cross-section that is cut into a compound shape that has both a vertical and sloped surfaces. Other embodiments may include grooves with sloped parallel surfaces formed into spiral or radial patterns.

Methods and apparatus for improved polishing of workpieces

A polishing apparatus for semiconductor wafers includes an index table with multiple wafer positions, with different surface treatment arrangements for each position. With each index motion of the table, the table is sequentially loaded and unloaded while wafers carried at the remaining stations of the index table are moved for a subsequent surface treatment step. Progress of the surface treatment at each position is monitored and, optionally, subsequent surface treatment steps may be modified to achieve a desired final condition of the substrate being processed.

Apparatus and method for the face-up surface treatment of wafers

A wafer carrier includes a porous media layer through which a pressurized fluid is injected. The porous media layer introduces lateral dispersion into the pressurized flow, thereby assuring a uniform pressure at the exit surface of the porous media layer, as when the porous media layer is located adjacent the wafer being polished. Alternatively, an inflatable bladder may be introduced between the porous media layer and the wafer, again with pressure being maintained uniform by the porous media layer.

Wafer polishing with improved backing arrangement

In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Method and apparatus for improved semiconductor wafer polishing

A ring extension is provided for use with a semiconductor wafer carrier. The ring extension has a radially inner surface, the lower portion of which contacts a peripheral edge of a wafer to confine the wafer during a polishing operation. A recess or groove is formed in the inner surface and a passageway extending through the ring extension provides pressure relief to prevent slurry build up.

Wafer polishing carrier and ring extension therefor

A probe assembly is provided for semiconductor wafer polishing and similar wafer treatments. The polishing table forms a recess for receiving the probe, with the probe free end located to view interior portions of a semiconductor wafer temporarily passing over the recess. Probe data may conveniently be used for polishing end point determination.

Wafer polishing with improved end point detection

A laser element is mounted above a polishing pad of a workpiece polishing machine to monitor and control flatness of the pad. Actual flatness of the pad is determined by a computer processor which receives thickness measurements from the laser element and compares the thickness at the inner diameter portion of the pad with the thickness at the outer diameter portion of the pad. If the flatness varies substantially from a target flatness, a conditioning device mounted on the machine is moved appropriately relative to the pad to conform its flatness to the target flatness.

Method and apparatus for monitoring and controlling the flatness of a

The present invention relates generally to a method for conditioning polishing materials that are generally used to polish disks used for magnetic recording. The polishing material is conditioned by moving a conditioning ring relative to the polishing material. More particularly, the conditioning ring is rotated and/or orbited across the surface of the polishing material, so that the material is conditioned. Preferably, the conditioning ring comprises an annular ring of abrasive material fixedly applied to a substantially planar surface of the conditioning ring.

Methods and apparatus for conditioning grinding stones

Conditioning of a polishing pad so as to control the surface profile and achieve uniformity in wear of a polishing pad by causing the workpiece and polishing pad to oscillate radially relative to one another with the extent of the oscillating movement being sufficient so that the workpiece extends over the edges of the polishing pad.

In-situ polishing pad flatness control

In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow. The device includes means for reversing the coolant flow supply from the inlet to the outlet while the abrading device is operational for effectuating more even temperature control across the lap plates. The abrading machine also may be provided with an abrasive fluid distribution system having a plurality of ring-like troughs being mountable above the upper lap plate concentrically and which are spaced radially from one another to supply abrasive fluid uniformly to the lapping surfaces. Each trough is provided with a plurality of passages that are positioned in a circumferentially staggered relation to uniformly supply abrasive fluid from the troughs to the lapping surfaces.

Dual column abrading machine

A method of fabricating a soft, resilient backing pad adapted for attachment to a pressure plate for planarizing work pieces wherein the outer exposed surface of the pad has been abraded by means of dry abrasive particles fixed on a surface of a spherical convex lapping wheel.

Backing pad

An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member. A detachable pressure plate is connected to the lower plate member by at least one quick release apparatus which utilizes a locking pin secured to the pressure plate and configured to fit through a bore in the lower plate member. In a second embodiment, the upper plate member has recesses in its top and bottom surfaces. The lower plate member includes recesses in its top surface which are aligned with the upper plate member. A plurality of springs held by connecting pins are disposed in the recesses, and a flexure spring is disposed between the upper and lower plate members.

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Niles, IL, United States of America

Joseph V Cesna