Samsung Electronics Co., Ltd.

Joon-su Ji

Jung-woo Kim

Jin-woo Jung

Shin-Ho Kang

Dany Kim

Han-jik Nam

A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

Probe card inspection wafer, probe card inspection system, and method of inspecting probe card

Provided is a probe card inspection apparatus including: a substrate; a first insulating layer which covers the substrate; and a first detection unit which is formed on the first insulating layer and detects physical defects of a probe of a probe card. The first detection unit includes: a ground detection unit including a first conductive pattern which defines a plurality of openings which expose a portion of the first insulating layer and detect defects of a ground probe of the probe card and; and a signal and power detection unit including a second conductive pattern which defines a plurality of openings which expose another portion of the first insulating layer and detect defects of a signal and power supply probe of the probe card.

Growing community of inventors

Hwaseong-si, South Korea

Joon-su Ji