Samsung Display Co., Ltd.

K. C. Tech Co., Ltd.

Ubmaterials Inc.

Ubmaterials Lnc.

Joon-Hwa Bae

Byoung Kwon Choo

Woo Jin Cho

Woojin Cho

Byung Hoon Kang

Hyun Jin Cho

Jun Hyuk Cheon

Heesung Yang

Seung Bae Kang

Bonggu Kang

Joo Woan Cho

Seungbae Kang

Byoung Ho Cheong

Kwang Suk Kim

Jeong Kyun Na

Seung Hwan Lee

Tae Wook Kang

Oleg Prudnikov

Jong Chan Lee

In-Sun Hwang

Joo-Woan Cho

Tae Joon Kim

Woong Hee Jeong

Jeong Min Park

Byoung-Kwon Choo

Jung Gun Nam

In Sun Hwang

Byoungkwon Choo

Byoung-Ho Cheong

Jin-Hyung Park

Jeong-Hye Choi

Bong Gu Kang

Hee Sung Yang

Jee-Hyun Lee

Young Ho Jeong

Jeong-Kyun Na

Sung Hyeon Park

Kyung Bo Lee

Keun Woo Lee

Jin Hyung Park

Jun Hyunk Cheon

Woo-Jin Cho

A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.

Substrate polishing apparatus

A polishing slurry is disclosed which includes about 0.01 wt % to about 10 wt % of polishing particles, about 0.005 wt % to about 0.1 wt % of a dispersing agent, about 0.001 wt % to about 1 wt % of an oxide-polishing promoter including a pyridine compound, about 0.05 wt % to about 0.1 wt % of a nitride-polishing inhibitor including an amino acid or an anionic organic acid, and water. A method for manufacturing a display device including an active pattern disposed on a base substrate, a gate metal pattern including a gate electrode overlapping the active pattern, a planarized insulation layer disposed on the gate metal pattern, and a source metal pattern disposed on the planarized insulation layer is also disclosed.

Polishing slurry, method for manufacturing a display device using the same and display device

A display device includes a planarization layer covering transistors in a display area on a substrate, an organic light emitting diode on the planarization layer, a pad electrode in a non-display area on the substrate surrounding the display area, and a sacrificial layer remnant capping a side surface of the pad electrode.

Display device and method of manufacturing the same

A method of manufacturing a detection sensor is disclosed. The method includes forming a biometric information sensing layer including a transistor on a base layer, forming an initial optical pattern layer on the biometric information sensing layer, patterning the initial optical pattern layer to form a plurality of transmissive portions spaced apart from each other and having a first zeta potential, coating a light blocking material to form an initial light blocking portion that covers a side surface and an upper surface of the transmissive portions and has a second zeta potential different from the first zeta potential, and polishing the initial light blocking portion such that the upper surface of the transmissive portions is exposed to form a light blocking portion. The initial light blocking portion is polished by the abrasive, which has the first zeta potential, using a pad.

Display device including detection sensor and method of manufacturing the detection sensor

A display device according to an embodiment includes: a substrate; a transistor that is disposed on the substrate; a light emitting diode that is disposed on the substrate, and connected to the transistor; and a passivation layer that is disposed between the transistor and the light emitting diode, wherein a surface step of the passivation layer is within a range of and including 1 nm to 30 nm.

Display device including passivation layer with surface step and manufacturing method for the same

A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Polishing head, substrate processing apparatus including the same and processing method of substrate using the same

A substrate polishing system includes: a polishing machine and a substrate transporter. The polishing machine includes: a lower surface plate to which a substrate is mounted, and an upper surface plate which faces the lower surface plate and polishes the substrate in cooperation with the lower surface plate, the upper surface plate having a larger area than the substrate mounted on the lower surface plate. The substrate transporter is adjacent to the polishing machine and commonly transports the substrate to and from the polishing machine in a first direction, attaches the substrate to the lower surface plate before polishing thereof, and separates from the lower surface plate the substrate after polishing thereof.

Substrate polishing system and substrate polishing method

A polarization module and a laser exposure apparatus have a polarization module including a first lens and a second lens that reduce a one-directional length of a cross-section of an incident laser beam having an optical axis. A polarization beam splitter divides the laser beam passing through the first and second lenses into two laser beams that are polarized in different directions with respect to each other. A first prism lens and a second prism lens emit an output laser beam by controlling the two laser beams that are divided by the polarization beam splitter to positions that are symmetrical with respect to the optical axis. At least one half wave plate is disposed between the polarization beam splitter and the first prism lens.

Polarization module and laser apparatus including the same

A method for manufacturing a display device includes forming a first gate metal wire on a substrate, forming a first insulation layer that covers the first gate metal wire, forming a second gate metal wire on the first insulation layer, forming a second main insulation layer that covers the second gate metal wire, forming a second auxiliary insulation layer on the second main insulation layer, forming an exposed portion of an upper surface of the second main insulation layer by polishing the second auxiliary insulation layer, and forming a first data metal wire on the second main insulation layer and the second auxiliary insulation layer.

Display device

A laser crystallizing apparatus includes a laser generator that generates an incident laser beam that includes a P polarization component and an S polarization component, an optical system that converts the incident laser beam to generate an emitted laser beam, and a stage on which is mounted a target substrate with a target thin film which is laser-crystallized by being irradiated by the emitted laser beam. The optical system includes at least one half wave plate (HWP) that shifts a polarization axis direction of the incident laser beam received from the laser generator, at least one mirror that fully reflects the laser beam, and at least one polarization beam splitter (PBS) which reflects a part of the laser beam and transmits the other part of the laser beam.

Laser crystallizing apparatus

Display device and manufacturing method thereof

A method of manufacturing a transistor display panel and a transistor display panel, the method including forming a polycrystalline silicon layer on a substrate; forming an active layer by patterning the polycrystalline silicon layer; forming a first insulating layer covering the substrate and the active layer; exposing the active layer by polishing the first insulating layer using a polishing apparatus; and forming a second insulating layer that contacts the first insulating layer and the active layer, wherein exposing the active layer by polishing the first insulating layer includes coating a first slurry on a surface of the first insulating layer, the first slurry reducing a polishing rate of the active layer.

Transistor display panel and manufacturing method thereof

A method of manufacturing a display device includes: forming an active layer on a substrate; forming a first insulation layer covering the active layer; forming a gate metal line on the first insulation layer; forming a third insulation layer covering the gate metal line and including a silicon oxide; forming a fourth insulation layer including a silicon nitride on the third insulation layer; forming a fifth insulation layer including a silicon oxide on the fourth insulation layer; arranging a blocking member over a region in which the active layer and the gate metal line overlap; forming a fifth auxiliary insulation layer by doping nitrogen ions in the fifth insulation layer; and exposing a part of an upper surface of the fourth insulation layer by removing a portion of a fifth main insulation layer of the fifth insulation layer which does not overlap the fifth auxiliary insulation layer.

A polishing slurry for silicon, a method of polishing polysilicon, and a method of manufacturing a thin film transistor substrate, the slurry including a polishing particle; a dispersing agent including an anionic polymer, a hydroxyl acid, or an amino acid; a stabilizing agent including an organic acid, the organic acid including a carboxyl group; a hydrophilic agent including a hydrophilic group and a hydrophobic group, and water, wherein the polishing particle is included in the polishing slurry in an amount of about 0.1% by weight to about 10% by weight, based on a total weight of the slurry, a weight ratio of the polishing particle and the dispersing agent is about 1:0.01 to about 1:0.2, a weight ratio of the polishing particle and the stabilizing agent is about 1:0.001 to about 1:0.1, and a weight ratio of the polishing particle and the hydrophilic agent is about 1:0.01 to about 1:3.

Polishing slurry for silicon, method of polishing polysilicon and method of manufacturing a thin film transistor substrate

Growing community of inventors

Suwon-si, South Korea

Joon-Hwa Bae