Oerlikon Surface Solutions Ag, Pfaffikon

Sulzer Metaplas Gmbh

Jones Alami

Jörg Vetter

Georg Erkens

Jürgen Müller

Tariq Rasa

The invention relates to a physical vapor deposition coating device (), comprising a process chamber () with an anode () and a consumable cathode () to be consumed by an electrical discharge for coating a substrate located within the process chamber (). The coating device () further includes a first electrical energy source () being connected with its negative pole to said consumable cathode (), and a second electrical energy source () being connected with its positive pole to said anode (). According to the invention, a third electrical energy source () is provided being connected with its negative pole to a source cathode () which is different from the consumable cathode (). In addition, the invention relates to a physical vapor deposition method for coating a substrate.

Physical vapour deposition coating device as well as a physical vapour deposition method

A high-power pulsed magnetron sputtering process, wherein within a process chamber by means of an electrical energy source a sequence of complex discharge pulses is produced by applying an electrical voltage between an anode and a cathode in order to ionize a sputtering gas. The complex discharge pulse is applied for a complex pulse time. The cathode has a target comprising a material to be sputtered for the coating of a substrate, and the complex discharge pulse includes an electrical high-power sputtering pulse having a negative polarity with respect to the anode and being applied for a first pulse-time, the high-power sputtering pulse being followed by an electrical low-power charge cleaning pulse having a positive polarity with respect to the anode and being applied for a second pulse-time. The ratio &#x3c4;/&#x3c4;of the first pulse-time (&#x3c4;) in proportion to the second pulse-time (&#x3c4;) is 0.5 at the most.

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Bergisch-Gladbach, Germany

Jones Alami