E.i. Dupont De Nemours and Company

John W Lott

Grant A Beske

Sam Andreades

Douglas M Haney

Thomas R Poulin

Patrick W Wallace

An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.

Chip carrier package and method of manufacture

Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises

Process for the preparation of flexible circuits

Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.

Growing community of inventors

Tinton Falls, NJ, United States of America

John W Lott