Applied Materials, Inc.

Ontrak Systems, Inc.

Other

John S Hearne

Robert B Lowrance

Boris Fishkin

Lynn S Ryle

David L Thrasher

Manoocher Birang

Robert D Tolles

Norman Shendon

Christopher Heung-Gyun Lee

Kenneth Reese Reynolds

Robert M Ruppell

Terry Kin-Ting Ko

Bryan Von Lossberg

Peter N Skarpelos

Tresea Furlong

Brian J Downum

Gary D Youre

Patrick Williams

Wilbur C Krussell

Daniel Hachnochi

Matthew G Garbett

Lidia Vereen

A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical mechanical polishing surface includes an arm having a plurality of holes formed in the arm for retaining a plurality of polishing fluid delivery tubes. Each of the tubes are disposed through one of the holes and coupled to the arm. The number of holes exceeds the number of tubes, thereby allowing the distribution of polishing fluid to a polishing surface and correspondingly the local polishing rates across a diameter of a substrate being polished to be controlled.

Flexible polishing fluid delivery system

The present invention is directed to a wafer clamping mechanism responsive to fluid pressure to retain wafers on a surface with minimal clamping force. The clamping mechanism houses simple operative elements within a housing proximate the wafer and can utilize existing fluid pressure sources to energize the clamping mechanism. In a first embodiment, the clamping mechanism includes a piston and cylinder to urge a clamping arm against the wafer in response to fluid pressure. In a second embodiment, the clamping mechanism includes a bellows arrangement for urging the clamping finger against the wafer in response to a fluid pressure source. In a third embodiment, the clamping mechanism includes a bladder arrangement wherein a bladder is expanded using fluid pressure to urge the clamping arm against the wafer in response to a fluid pressure source. In a fourth embodiment, the clamping mechanism includes a flexure member attached to a dual bellows arrangement for urging the flexure member against the wafer in response to a vacuum pressure source. In a fifth embodiment, the clamping mechanism includes a bent flexure member attached to a dual bellows arrangement with an internal piston and cylinder for urging the flexure member against the wafer in response to positive pressure source.

Hydraulically actuated wafer clamp

A polishing agent delivery system for a wafer processing system includes multiple tanks each of which can hold a supply of a respective polishing agent constituent, such as a slurry constituent, a buffing agent or a cleansing agent. The system also includes multiple containers, each one of which can hold a respective polishing agent constituent. Additionally, each container has a motor-driven piston that can be operated to cause the respective polishing agent constituent to be dispensed from the container to a wafer processing station and which can be operated to cause additional polishing agent constituent to be drawn into the container from a corresponding one of the tanks. The apparatus also includes a controller for controlling a respective rate of linear displacement of each motor-driven piston. Stepper motors or servo-motors can be used. The system allows changes to slurry mixtures to be made quickly and efficiently, and different slurry or buffing mixtures can be used for different polishing stations. Furthermore, the system can provide tight control over the dispensing operations so that precise, predetermined amounts of each constituent are mixed into the slurry. The system is highly modular which can facilitate the delivery of slurry or other polishing agents to additional polishing stations. The rate at which various polishing agent constituents are delivered to a wafer polishing station can be altered dynamically during a wafer polishing cycle or between cycles.

Delivery of polishing agents in a wafer processing system

A method of removing liquid on a substrate, the method comprising the steps of placing the substrate in a fluid reservoir having a surface level, maintaining a partial pressure of vapor over the fluid surface level, lowering the fluid surface level of the reservoir while adding fluid, whereby the liquid flows off the substrate, and holding the substrate at different holding points, while lowering the fluid surface level so that the lowering surface level does not pass across a holding point that is being used to hold the substrate.

Method of drying a substrate by lowering a fluid surface level

A drying apparatus 20 for removing residual liquid from a substrate surface comprises a vapor chamber 25 having a vapor distributor 30 for introducing vapor into the chamber. The drying apparatus 20 further comprises a fluid system 35 comprising (i) a reservoir 40, (ii) a fluid dispenser 45 for introducing fluid into the reservoir, and (iii) a fluid level adjuster 50 for lowering a fluid surface level in the reservoir 40. A multi-point holder 62 is used for holding the substrate 55 at different holding points 63 on the substrate, while the fluid surface level is lowered relative to the substrate, so that residual liquid flows off the substrate surface without intersection of the lowering fluid surface level with holding points 63 on the substrate. The drying apparatus 20 dries substrates 55 substantially without forming stains or streaks, or causing contamination or liquid residue to remain on the substrate 55.

Method and apparatus for drying substrates

An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination. Various flow meters are mounted on a transparent panel to provide easy and convenient hook-up. The system is provided with an airflow control bulkhead between the clean and dirty side of the system to prevent intermixing to thereby provide for lower contamination levels in the clean side of the system.

Substrate processing system

Contamination control in substrate processing system

A wafer holder which grips a wafer by its edges is disclosed. The wafer holder is mounted on a spindle assembly which spins the wafer so held, for example, to spin dry both the front and back side of the wafer. The wafer holder includes two pairs of wafer holding bumpers, each pair coupled to one end of a reciprocating arm which swings each pair inward and outward to define an open position for releasing or loading a wafer, and a closed position for holding the wafer. Each arm is coupled to an insert and thrust bearing allowing for rotation to provide the reciprocating motion. After the insert and thrust bearing have toggled past a predefined position while the wafer holder is in the closed position, further motion is prevented, to lock the wafer holder in the closed position. Further, the insert member rotates back and forth in response to up and down movement of a rod within the spindle to allow for opening and closing of the wafer holder.

Spindle assembly with improved wafer holder

A method of using waste materials produced by coal combustion to produce useful products. In one embodiment the invention provides solid bricks produced by compressing together fly ash, bottom ash, gypsum, calcium carbonate, and lime. These bricks have sufficient structural strength for use in building and construction. In another embodiment, waste materials are encapsulated in a mixture of fly ash, bottom ash, gypsum, lime, and calcium carbonate and compressed into bricks that may be disposed of in an environmentally acceptable manner. Further, the compressed bricks containing waste material may be coated with an impermeable membrane of a synthetic polymeric material. Further, the invention provides a mobile, trailer-mounted apparatus for compressing the mixtures into bricks.

Process for producing solid bricks from fly ash, bottom ash, lime,

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Los Altos, CA, United States of America

John S Hearne