Varian Semiconductor Equipment Associates, Inc.

John Robert Fairhurst

Richard John Hertel

Jeffrey E Krampert

Richard S Muka

Edward D MacIntosh

A system and method are disclosed for holding and cooling substrates during processing. A substrate clamp has an engagement portion for engaging a substrate about the inside diameter as well as a portion of the substrate surface immediately adjacent to the inside diameter. The clamp has a retracted position which enables the engagement portion to fit through the substrate ID, and an expanded position which enables the engagement portion to engage the substrate ID and the substrate surface immediately adjacent to the inside diameter. The clamp can include a conformal coating to enhance engagement between the substrate and the engagement portion. The clamp can also include an energy absorbing coating on one or more surfaces to maximize the absorption of radiative energy emitted from the substrate. Other embodiments are described and claimed.

Method and apparatus for clamping and cooling a substrate for ion implantation

A substrate carrier includes a carrier plate, a cover plate and a plurality of substrate support slots. The carrier plate has recesses for receiving substrates. A sidewall of each recess includes protrusions for engaging the OD of a substrate. The cover plate is rotatable and has a cam on an undersurface. The cam is enagageable with a lateral slot in each of a plurality of substrate supports of the carrier plate. Rotating the cover plate causes the cam to move the substrate supports, one by one, so a substrate engaging end of the substrate support moves away from an associated substrate recess. A substrate is loaded into the recess, whereupon the cover plate is rotated further so the cam disengages from the lateral slot. The substrate supports are biased to engage the OD of the substrate to lock the substrate within the recess. Other embodiments are described and claimed.

Method and apparatus for holding a plurality of substrates for processing

A system and method are disclosed for removing vertically oriented substrates from a cassette. A lifter includes a lifter notch and a stabilizer notch for holding a substrate. The lifter notch engages and lifts the substrate along the substrate ID, while the stabilizer notch captures the substrate OD to prevent lateral movement of the substrate during lifting. In use, the cassette is tilted to bias all substrates to one side and ensure consistent spacing. The lifter moves up into the cassette until the notches are adjacent, but beneath, the ID and OD of a substrate. The lifter is moved laterally to position the notches directly below the ID and OD. Upward movement of the lifter causes the lifter notch to lift the substrate along the ID. The lifter continues upward with the substrate until the substrate clears the top of the cassette. Other embodiments are described and claimed.

Method and apparatus for removing a vertically-oriented substrate from a cassette

A system and method are disclosed for removing horizontally oriented substrates from a cassette. A substrate lifter has an engagement end for engaging a substrate and an adjustment end for engaging an adjustment assembly. The engagement end includes a recess having first and second arcuate sidewalls configured to engage an OD of the substrate, and a circular protrusion positioned between the first and second arcuate sidewalls. The circular protrusion allows lateral movement of the substrate up to a predetermined amount and prevents lateral movement of the substrate in excess of the predetermined amount. Other embodiments are described and claimed.

Method and apparatus for lifting a horizontally-oriented substrate from a cassette

A device is disclosed for manipulating a substrate having an inside diameter (ID). The device includes a handle, a trigger that slides within the handle, an alignment shaft and a plurality of substrate supports having distal ends. A plurality of substrate support actuators are connected to the trigger. The trigger can move the plurality of substrate supports between a substrate engaging position and a substrate releasing position through selective engagement of the plurality of substrate supports by the plurality of substrate support actuators. In the substrate engaging position the distal ends of the substrate supports move radially outward to engage the ID of the substrate, enabling the device to hold the substrate without touching the substrate faces. Other embodiments are described and claimed.

Growing community of inventors

Plaistow, NH, United States of America

John Robert Fairhurst