Eastman-kodak Company

John R Guild

Robert C Daly

Light-sensitive compositions containing a quinone diazide which are useful in positive-working photoresists and positive-working lithographic printing plates are developed with a developing composition comprising a quaternary alkanol ammonium hydroxide developing agent and a stabilizing concentration of a semicarbazide.

Development of light-sensitive quinone diazide compositions

There are disclosed resist developers in which additives selected from certain tetraalkylammonium or phosphonium cations, benzyltrialkylammonium or phosphonium cations, and benzyltriphenylammonium or phosphonium cations, are effective in enhancing the developer selectivity.

Resist developer with ammonium or phosphonium compound and method of use

There are disclosed a resist composition and imaging method wherein the development rate of the composition is improved by using a polyhalogenated heterocyclic sensitivity-enhancing agent.

Positive-working resist quinone diazide containing composition and

A process is disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.

Blank and process for the formation of beam leads for IC chip bonding

Light-sensitive compositions containing a quinone diazide which are useful in positive-working photoresists and positive-working lithographic printing plates are developed with a developing composition comprising a quaternary alkanol ammonium hydroxide developing agent and a stabilizing concentration of a sulfite.

Development of light-sensitive quinone diazide compositions using

A three-layer blank and a process are disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.

Blank beam leads for IC chip bonding

Light-sensitive compositions containing a quinone diazide which are useful in positive-working photoresists and positive-working lithographic printing plates are developed with a developing composition comprising methyltriethanol ammonium hydroxide. The developing composition provides the advantage that it is free of metal ions and, accordingly, does not contaminate the surface of the image. It is additionally advantageous in that it provides extended development latitude, increased exposure latitude, improved resist contrast, improved prebake latitude, a low depletion rate and minimal loss of image layer thickness.

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Rochester, NY, United States of America

John R Guild