Advanced Micro Devices Corporation

John Heon Yi

Steven R Klassen

Chandrakant Pandya

Trent Johnson

Satwant Singh

Jeff Brinkley

Fu-Weng Tea

Terry Marquis

Glenn Eubank

Michael Gregory Tarin

A burn-in test system. A burn-in test system includes a device under test (DUT), a temperature controller coupled to the DUT, and a test controller. During testing, the test controller: (a) sets a parameter of the DUT to a first value and applies a test stimulus to the DUT, and (b) sets the parameter of the DUT to a second value and applies the test stimulus to the DUT. A change in the value of the parameter results in a change in the amount of heat dissipated by the DUT. The temperature controller maintains the DUT at a pre-determined temperature during testing with the parameter set to both the first and the second values. The DUT may be further coupled to a module that comprises circuitry employed in a product-level application environment. The module is configured by the test controller to simulate a product-level application.

Burn-in using system-level test hardware

An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrated circuit, is covered by a block of thermally conductive material of predetermined thickness T, where T is a function of a desired temperature profile and, optionally, the current drawn by the microprocessor undergoing testing.

Temperature control of an integrated circuit

Parametric test data is taken on a sampled set of a particular integrated circuit (IC) using both an Automatic Test Equipment (ATE) tester and a system test motherboard. The parametric test data comprises maximum operating frequency, maximum operating temperature and minimum operating power supply voltage. A maximum operating frequency is determined at a particular fixed operating temperature and power supply voltage. A maximum operating temperature is determined at a particular fixed operating frequency and power supply voltage. Finally, a minimum operating power supply voltage is determined at a particular fixed operating frequency and temperature. Multiple two parameter graphs are plotted and the slope or numerical derivative for each plot is calculated as conversion factors. During a normal production run for the particular IC performance limit data is taken on the ATE tester comprising the same three parameters of maximum operating frequency at a particular temperature and power supply voltage. The calculated conversion factors are used to scale the production parametric data from the ATE tester to new calculated expected performance limits. These new performance limits are used to sort production ICs into system performance classes for which the ICs are expected to qualify.

Processor IC performance metric

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Austin, TX, United States of America

John Heon Yi