Scd Mountain View, Inc.

John H Anderson Sr

Suraj Puri

Raj Mohindra

Rajiv Bhushan

Abhay K Bhushan

Jeffrey Nowell

A method ( ) for cleaning a semiconductor wafer. The method includes immersing ( ) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step ( ) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

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Milpitas, CA, United States of America

John H Anderson Sr