Silicon Laboratories Inc.

International Business Machines Corporation

Cirrus Logic Inc.

Black Sand Technologies, Inc.

John Blake Pavelka

Timothy Joseph Dupuis

David R Welland

Edmund G Healy

Hilton T Toy

Susanne A Paul

Frank Louis Pompeo

Jonathan Taylor

Steven A Atherton

Joseph Ying-Yuen Chan

Craig McAdam

Douglas Macfarlane

John Kerr

James Munger

David Clifford Long

Martin Jay Marotti

Jon Alfred Casey

Raschid Jose Bezama

Louis Bennie Capps, Jr

Roland N Zapfe

Raed A Sherif

Glenn A Pomerantz

Gaetano Paolo Messina

Lysander Lim

Raymond J Speer

John V Acciaioli

Larry D Gross

Karl Friedrich Stroms

Leon Cavanagh

Peter Smith

An Xuan Tra

Son Hung Lam

Myra Muth Boenke

Albert J Fahey

Gerhard Weiss, Deceased

The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.

Chip scale package

A technique for forming an integrated circuit die that contains an integrated sensor is provided. The integrated circuit die may be configured such that the sensor is exposed to ambient environmental conditions such that the sensor may detect ambient conditions. The integrated circuit die may be generally protected from environmental exposure by a mold resin. The mold resin may be formed in areas outside of a sensor region. Resin bleed from the mold resin into the sensor region may be prevented by the use of a resin dam that extends from the surface of the integrated circuit die. The resin dam may surround the sensor region.

Integrated circuit with sensor area and resin dam

Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.

Systems and methods for packaging integrated circuit gas sensor systems

A current sensor includes a coils located within the integrated circuit die and inductively coupled to a conductor located in the integrated circuit package holding the die. The inductors sense the current in the conductor and supply the sensed signal to an integrator that supplies a voltage indicative of the current in the conductor.

Current sensor including an integrated circuit die including a first and second coil

A method and apparatus is provided for use in power amplifiers for reducing the peak voltage that transistors are subjected to. A power amplifier is provided with first and second switching devices and an inductor connected between the switching devices. The switching devices are driven such that the switching devices are turned on and off during the same time intervals.

RF power amplifier and method for packaging the same

An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.

Integrated current sensor package

A current sensor includes coupled inductors that generate an output current responsive to a detected current. The coupled inductor is implemented in an integrated circuit. An integrator circuit generates a sensed voltage responsive to the output current.

Integrated current sensor

A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

Method and apparatus for synthesizing high-frequency signals for wireless communications

A method and apparatus for synthesizing high-frequency signals that overcomes integration problems while meeting demanding phase noise and other impurity requirements. In one embodiment, on-package oscillator circuit inductors are provided for band selection purposes, with no external package connection to connect off-package or external inductors to on-package inductance circuits. Multiple package electrical connection points may also be provided on-package to allow for selection of alternate oscillator inductance values during package assembly.

Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors

A process and apparatus for picking up and moving a microelectronic package during card assembly operations. A temporary lid having a top surface and a bottom surface attaches to at least one microchip on a substrate via a double-sided adhesive. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. After completion of the steps where vacuum probe movement is required, the lid and adhesive may be removed from the at least one microchip by pulling them both off together. No residue is left on the microchips.

Microelectronic package module with temporary lid

Process for adhesively attaching a temporary lid to a microelectronic

Lid for a microelectronic package

Growing community of inventors

Austin, TX, United States of America

John Blake Pavelka