International Business Machines Corporation

John A Paivanas

Javathu K Hassan

Sevgin Oktay

Robert L Judge

I Joseph DeRobertis

Clarence J Spector

Javanthu K Hassan

A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink. The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low current load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

Semiconductor assembly employing noneutectic alloy for heat dissipation

An aspirator jet suction pick-up device for moving green sheets or other flexible materials employs a source of gas under positive pressure into the head with exhaust via a network of slots disposed along the pick-up surface of the head. As the gas exhausts through the ends of the slots via a manifold or plenum, an open groove on the pick-up surface entrains aspirated air causing a localized suction force. The suction force due to aspiration uniformly and stably holds a flexible sheet on the pick-up surface.

Pick-up head utilizing aspirated air flow

A transport system is disclosed, including an air film shuttle conveyor for conveying semiconductor chips from a loading to an unloading station, the conveyor comprising a base plate and upstanding side guide walls extending longitudinally of the base plate, the guide walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream such that the slight spacing between the chips and the guide walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.

Chip shuttle track

A manufacturing processing system comprises a plurality of processing stations, preferably vacuum stations, interconnected by air track, preferably an axi-radial air track with novel sections rotatable about a transverse axis in the plane of the track and normal to the travel of the objects, hereafter referred to as swivelators. Certain of the swivelators are formed with axial movable portions capable of moving beyond the plane of the air track surface and returning to the plane, so that these swivelators can pick up and set down objects in predetermined positions in the manufacturing processing station with an air force so as to not make physical contact with the objects. A novel gas lock device is positioned in the air track between those processing stations, in which the gas pressure must be separated so as to essentially eliminate the possibility of gas contaminant passing from one station to the next. The gas lock comprises an air track compartment having closable sides or panels in the path of the travel of the object being transported along the air track.

Gas film wafer transportation system

A method and apparatus for obtaining a uniform gaseous molecular field under high vacuum conditions encountered in a dry etching process. In the method a source of a gas is provided and introduced into a manifold. The manifold feeds at least one nozzle and the gas is passed through the manifold and through the nozzle into a chamber maintained under vacuum conditions. The pressure of the gas and the configuration of the manifold and nozzle are such that the gas is caused to exit from the nozzle into the chamber under vacuum at sonic velocity.

Method and apparatus for gas feed control in a dry etching process

A contactless air film lift-up device constructed to utilize the pressure-velocity relationship expressed in the Bernoulli principle to provide a desired pick-up action, while at the same time generating a lateral restraining force through a further utilization of the Bernoulli principle.

Contactless air film lifting device

This specification deals with the stopping, positioning, orienting and redirecting a semiconductor wafer being transported along a track on an air film or bed of air. The stopping mechanism is an air jet located in a groove in the track, wafers passing over this air jet on an air film are sensed by a pneumatic sensor that turns on the air jet to set up an air stream under the transporting surface of the air film. This air stream sucks the fluid in the air film along with it in the groove causing a vacuum in the bed in the area of the nozzle of the air jet. The wafers are then stopped by the suction of the vacuum. Positioning, orienting and redirecting is done using the air jet and pneumatic sensor in combination with special air jet arrangements and operations.

Pneumatic control of the motion of objects suspended on an air film

The transportation of semiconductor wafers along a track on an air film. The supporting air film is controlled by the track configuration and fluid relationships to eliminate the need of a wafer guide on restraint to keep the wafers on the track.

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Hyde Park, NY, United States of America

John A Paivanas