Schott Solar Ag

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Joerg Horzel

Gabriele Blendin

Berthold Schum

Wilfried Schmidt

Agata Lachowicz

Dieter Franke

Marco Faber

A method for producing a dopant profile is provided. The method includes starting from a surface of a wafer-shaped semiconductor component by introducing dopant atoms into the semiconductor component. The dopant-containing layer is produced on or in a region of the surface in order to produce a provisional first dopant profile and then a plurality of semiconductor components having a corresponding layer is subjected to heat treatment on top of one another in the form of a stack in order to produce a second dopant profile having a greater depth in comparison to the first dopant profile.

Method for producing a dopant profile

A method is provided for forming a dopant profile based on a surface of a wafer-like semiconductor component with phosphorus as a dopant. The method includes the steps of applying a phosphorus dopant source onto the surface, forming a first dopant profile with the dopant source that is present on the surface, removing the dopant source, and forming a second dopant profile that has a greater depth in comparison to the first dopant profile. In order to form an optimized dopant profile, the dopant source is removed after forming the first dopant profile, and precipitates that are crystallized selectively on or in the surface from the precipitates SiPand SiPOare removed.

Method for forming a dopant profile

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Heverlee, Belgium

Joerg Horzel