Micron Technology Incorporated

Micron Electronics, Inc.

Joe M Jeddeloh

Paul A LaBerge

Brent Keeth

A Kent Porterfield

Troy A Manning

Timothy B Cowles

Chris G Martin

Ralph James

Jim Rehmeyer

Dean A Klein

Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.

Memory devices and methods for managing error regions

Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Flexible memory system with a controller and a stack of memory

Some embodiments include apparatuses and methods having a first interface to communicate with a processing unit, a second interface to communicate with a memory device, and a module coupled to the first and second interfaces. In at least one of the embodiments, the module can be configured to obtain information stored in the memory device and perform at least one of testing and repairing of a memory structure of the memory device based at least in part on the information.

Apparatuses and methods for memory testing and repair

Some embodiments include apparatuses and methods having a memory unit and a controller device. The controller device can be configured to receive a request from a host device and access a data structure in the memory unit to determine whether information associated with the request is in the data structure. The controller device can be configured such that if a fault related to accessing the data structure occurs, the controller device continues searching for the information associated with the request without notifying the host device of the fault.

Apparatuses and methods having memory tier structure and recursively searching between tiers for address in a translation table where information is only directly transferred between controllers

Memory requests for information from a processor are received in an interface device, and the interface device is coupled to a stack including two or more memory devices. The interface device is operated to select a memory device from a number of memory devices including the stack, and to retrieve some or all of the information from the selected memory device for the processor. Additional apparatus, systems and methods are disclosed.

Stacked memory devices, systems, and methods

Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.

Growing community of inventors

Shoreview, MN, United States of America

Joe M Jeddeloh