Asahi Kasei Kogyo Kabushiki Kaisha

Jiro Sato

Hideo Ai

Toru Mori

Hideki Matsuda

Akihiko Ideda

Method for producing printed circuit board using a photocurable resin laminate comprising a support and a photocurable resin layer disposed on one surface of said support, said photocurable resin layer having:

Method for producing printed circuit board using photocurable resin

A photopolymerizable laminate comprising a photopolymerizable layer and a support layer, said photopolymerizable layer containing; (1) 5 to 95% by weight, based on the total weight of the photopolymerizable layer, of a binder comprising a vinyl polymer or a vinyl copolymer, (2) 95 to 5% by weight, based on the total weight of the photopolymerizable layer, of a monomeric component containing at least 50% by weight of at least one compound selected from the group consisting of the photopolymerizable unsaturated compounds represented by the formulae (A), (B) and (C) shown below and having a value of molecular weight/number of double bonds contained of 1000 or less, and (3) 0.01 to 30% by weight, based on the total weight of the photopolymerizable layer, of a photopolymerization initiator. ##STR1##

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Fuji, Japan

Jiro Sato