Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Jing An Hao

Qiang Zhang

Bin Xing

An alignment method and an alignment system are provided. The alignment method includes: providing a wafer including an exposed surface, wherein an alignment mark and a reference point with a reference distance are provided on the exposed surface; placing the wafer on a reference plane; performing an alignment measurement on the exposed surface to obtain a projection distance, configured as a measurement distance, between the alignment mark and the reference point on the reference plane; performing a levelling measurement between the exposed surface and the reference plane to obtain levelling data of the exposed surface; obtaining a distance, configured as an expansion reference value, between the alignment mark and the reference point in the exposed surface; obtaining an expansion compensation value based on a difference between the expansion reference value and the reference distance; and adjusting parameters of a photolithography process based on the expansion compensation value for an alignment.

Alignment method and alignment system thereof

In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing a wafer, forming a first to-be-connected member and multiple first alignment members in a first conductive layer; form a first opening and multiple second alignment members in a first mask layer, the first opening is used to define a position of a second to-be-connected member; based on reference and measurement coordinates of the first alignment members, and reference coordinates and measurement coordinates of the second alignment members, obtaining wafer coordinates for characterizing a position deviation of the wafer; obtaining adjustment compensation values according to stacking offsets of a preceding wafer; adjusting a position of the wafer; forming the interconnection structure in a first dielectric layer and a second dielectric layer to electrically interconnect the first to-be-connected member and the second to-be-connected member.

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Shanghai, China

Jing An Hao