Samsung Electronics Co., Ltd.

Jihyung Yu

Daewon Ha

Kyung-Chang Ryoo

Song Yi Kim

JaeHee Oh

Daehwan Kang

Hongsik Jeong

A variable resistance memory system includes a variable resistance memory device including a memory cell array including first and second areas; and a memory controller configured to control the variable resistance memory device. The first area includes first variable resistance memory cells including a first variable resistance material layer and the second area includes second variable resistance memory cells including a second variable resistance material layer having a metallic doping concentration higher than a metallic doping concentration of the first variable resistance material layer. The first variable resistance memory cells are used as storage and the second variable resistance memory cells are used as a buffer memory.

Variable resistance memory device and a variable resistance memory system including the same

An integrated circuit device may include a semiconductor substrate including an active region and a transistor in the active region. The transistor may include first and second spaced apart source/drain regions in the active region of the semiconductor substrate, and a semiconductor channel region between the first and second source/drain regions. The semiconductor channel region may include a plurality of channel trenches therein between the first and second source/drain regions. A gate insulating layer may be provided on the channel region including sidewalls of the plurality of channel trenches, and a gate electrode may be provided on the gate insulating layer so that the gate insulating layer is between the gate electrode and the semiconductor channel region including the plurality of channel trenches. Related methods are also discussed.

Integrated circuit semiconductor devices including channel trenches and related methods of manufacturing

Growing community of inventors

Anyang-si, South Korea

Jihyung Yu