International Business Machines Corporation

Globalfoundries Inc.

Jie Deng

Alexander Reznicek

Pranita Kerber

Qiqing Christine Ouyang

Jae-Eun Park

Kern Rim

Xiangdong Chen

Paul S Chang

Xiaobin Yuan

Xiaojun Yu

Anda C Mocuta

Deleep R Nair

Weipeng Li

Daniel K Tekleab

Nam Sung Kim

Sim Y Loo

Terrence B Hook

Terence B Hook

Michael Claus Olsen

Madan Mohan Naga Nutakki

A semiconductor device includes at least one semiconductor fin on an upper surface of a substrate. The at least one semiconductor fin includes a channel region interposed between opposing source/drain regions. A gate stack is on the upper surface of the substrate and wraps around sidewalls and an upper surface of only the channel region. The channel region is a dual channel region including a buried channel portion and a surface channel portion that completely surrounds the buried channel.

Semiconductor device including epitaxially formed buried channel region

A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis.

Compact model for device/circuit/chip leakage current (IDDQ) calculation including process induced uplift factors

Performing a transient analysis with a compact FET model that is predominantly intended for DC analysis, such as an IDDQ leakage model, to enable toggling logic states in sequential logic circuits that cannot otherwise be examined in a DC analysis. An embodiment enables examining the DC or AC conditions of any logic state of any logic circuit in a DC or AC analysis, and additionally, it eliminates a potentially long execution time of a transient analysis with a DC model. Further solved is the present need to run two simulations and to maintain two netlists in order to overcome being unable to toggle certain logic states in the DC analysis. The invention achieves the aforementioned in a single simulation with a single netlist that calculates the DC operating circuit conditions with a model A on the fly at predetermined times or in certain logic states, during a transient analysis with a model B.

Method for dynamically switching analyses and for dynamically switching models in circuit simulators

A field effect transistor includes a partial SiGe channel, i.e., a channel including a SiGe channel portion, located underneath a gate electrode and a Si channel portion located underneath an edge of the gate electrode near the drain region. The SiGe channel portion can be located directly underneath a gate dielectric, or can be located underneath a Si channel layer located directly underneath a gate dielectric. The Si channel portion is located at the same depth as the SiGe channel portion, and contacts the drain region of the transistor. By providing a Si channel portion near the drain region, the GIDL current of the transistor is maintained at a level on par with the GIDL current of a transistor having a silicon channel only during an off state.

Asymmetric channel MOSFET

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Wappingers Falls, NY, United States of America

Jie Deng