Shanghai Micro Electronics Equipment (group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Jiaozeng Zheng

Gang Wang

Jie Jiang

Weiwang Sun

Cuixia Tian

Shaoyu Wang

Wenli Tang

Yunbin Pu

Jinguo Yang

Xinke Lang

Xiwen Zhou

An edge exposure apparatus and method are disclosed. The edge exposure apparatus includes: a base frame (); an edge exposure unit () mounted on the base frame and configured to perform an edge exposure process on a wafer; a pre-alignment unit () for centering and orienting the wafer and cooperating with the edge exposure unit () in the edge exposure process; a cassette unit () for storing and detecting the wafer; a robotic arm () for transferring the wafer; and a master control unit () for controlling the above components of the edge exposure apparatus. The edge exposure unit () and the pre-alignment unit () share a common worktable, resulting in structural compactness. Alternatively, two pre-alignment units () and two edge exposure units () may be included in order to increase processing efficiency.

Edge exposure device and method

A method for pre-aligning a substrate includes the steps of: 1) providing a substrate having a plurality of marks are arranged circumferentially on a surface thereof, wherein each of the plurality of marks consists of at least one first stripe extending in a first direction and at least one second stripe extending in a first direction; 2) aligning a center of the substrate with a given point on a substrate carrier stage; 3) illuminating a mark selected from the plurality of marks on the surface of the substrate with light and obtaining an image of the selected mark; 4) processing the image to obtain first projection data corresponding to the first direction and second projection data corresponding to the second direction; 5) identifying a set of first peak values corresponding to the at least one first stripe of the selected mark from the first projection data and a set of second peak values corresponding to the at least one second stripe of the selected mark from the second projection data; 6) selecting first peak values and second peak values that a) correspond to numbers of the at least one first stripe and the at least one second stripe and b) are deemed authentic, from the set of first peak values and the set of second peak values identified in step 5) and proceeding to step 7); otherwise selecting a next mark as the selected mark and returning to step 4); 7) calculating a current position of the selected mark relative to the substrate carrier stage based on the first and second peak values selected in step 6); and 8) rotating the substrate, according to the current position of the selected mark relative to the substrate carrier stage calculated in step 7), a relative position of the selected mark on the substrate and a desired rotation angle of the substrate relative to the substrate carrier stage, until the substrate is oriented at the desired rotation angle.

Substrate pre-alignment method

An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system () has a horizontal axis (X) defined by a line passing through the center of the wafer stage and a center of the mark detection system () and a vertical axis (Y) defined by a line crossing the horizontal axis (X) at right angles and passing through the center of the wafer stage.

Pre-alignment device and method for wafer

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Shanghai, China

Jiaozeng Zheng