Applied Materials, Inc.

Jianshe Tang

Shou-Sung Chang

Haosheng Wu

Brian J Brown

Hari N Soundararajan

Boris Fishkin

Paul D Butterfield

Chih Chung Chou

Alexander John Fisher

Jimin Zhang

Wei Guang Lu

Hui Chen

Yen-Chu Yang

Hui W Chen

Stephen Jew

Alexander N Lerner

David Maxwell Gage

Bum Jick Kim

Jeonghoon Oh

Shijian Li

Benjamin Cherian

Michael N Sugarman

Shih-Haur Shen

Haoquan Fang

Younes Achkire

Boris T Govzman

Chad Pollard

Taketo Sekine

Guy Shirazi

Rajeev Bajaj

Seshadri Ganguli

Thomas H Osterheld

Roey Shaviv

Suketu Arun Parikh

Rashid Mavliev

Joung Joo Lee

Rong Tao

Shirish A Pethe

Michael Anthony Stolfi

Priscilla Diep

Priscilla Diep LaRosa

Wei Lu

Fred Conrad Redeker

Steven Verhaverbeke

Feng Quan Liu

James S Papanu

Han-Wen Chen

Roman Gouk

Robert D Tolles

Charles C Garretson

David Masayuki Ishikawa

You Wang

Bo Xie

Zhiyong Li

Benjamin A Bonner

Jim Kellogg Atkinson

Dennis J Yost

Yufei Chen

Clinton P Sakata

David P Alvarez

Ningzhuo Cui

Andrew Siordia

Yunshuang Ding

Rashid Mavleiv

Ching-Hwa Weng

Chih Chung

Xingfeng Wang

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

In-situ conditioner disk cleaning during CMP

An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

Steam treatment stations for chemical mechanical polishing system

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

Method for CMP temperature control

The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

Apparatus and method for CMP temperature control

A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

Wafer edge asymmetry correction using groove in polishing pad

A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.

Temperature control of chemical mechanical polishing

The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

Steam-assisted single substrate cleaning process and apparatus

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

Slurry distribution device for chemical mechanical polishing

Methods and apparatus for creating a dual metal interconnect on a substrate. In some embodiments, a first liner of a first nitride material is deposited into at least one 1X feature and at least one wider than 1X feature, the first liner has a thickness of less than or equal to approximately 12 angstroms; a second liner of a first metal material is deposited into the at least one 1X feature and at least one wider than 1X feature; the first metal material is reflowed such that the at least one 1X feature is filled with the first metal material and the at least one wider than 1X feature remains unfilled with the first metal material; a second metal material is deposited on the first metal material, and the second metal material is reflowed such that the at least one wider than 1X feature is filled with the second metal material.

Methods and apparatus for forming dual metal interconnects

A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

Chemical mechanical polishing using time share control

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San Jose, CA, United States of America

Jianshe Tang