Tpk Touch Solutions (xiamen) Inc.

Jiangnan University

Anjoy Foods Group Co., Ltd.

Jiangping Chen

Yuh-Wen Lee

Yu Zhang

Hao Chen

Hao Zhang

Gang Wang

Jianxin Zhao

Daming Fan

Hsiang-Lung Hsia

Bowen Yan

Liangzhen Xu

Hebo Yang

Jianlian Huang

Quanfen Dai

Dongmei Ye

Hongwei Cao

Xuepeng Li

Wenguo Zhou

Wenhai Zhang

Xidong Jiao

Weijian Ye

Dengying Lei

Qingmiao Zhang

Tenghui Yu

The present invention discloses a microwave and conduction combined heating method for improving the gel strength of surimi products, belonging to the technical field of food processing. According to the present invention, surimi is first fully gelatinized by conduction heating, and then heated by microwave heating so that surimi gel can pass through a gel cracking zone quickly. This kind of microwave and conduction combined heating way can not only increase the gel strength of the surimi to achieve the desired elasticity, but also can save a lot of time and improve the production efficiency. Compared with ordinary microwave heating, the microwave and conduction combined heating method of the conduction and microwave heat preservation, i.e. holding the temperature of the surimi products for a period of time by adjusting the microwave power level at a specified temperature range, can effectively improve the gel strength of the surimi and comply with the new trend of applying microwave heating to surimi products.

Microwave and conduction combined heating method for improving gel strength of surimi products

A touch panel includes a substrate, a touch sensing structure and a fingerprint identification module. The touch sensing structure is disposed on the substrate. The fingerprint identification module is directly adhered to the substrate. The touch sensing structure and the fingerprint identification module are located at the same side of the substrate.

Touch panel with function of fingerprint identification

A touch panel with fingerprint identification includes a fingerprint identification module disposed in a through hole of a first substrate. The fingerprint identification module and the first substrate are attached to a second substrate.

Touch panel with fingerprint identification

Growing community of inventors

Xiamen, China

Jiangping Chen