Chartered Semiconductor Manufacturing Ltd (corporation)

Jian-Hui Ye

Mei-Sheng Zhou

Simon Yew-Meng Chooi

Young-Tong Tsai

Yuan-Ping Lee

Ai-Qiang Zhang

Yong-Feng Lu

A method for forming a patterned metal layer within a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed over the substrate a blanket metal layer. There is then formed over the blanket metal layer a patterned photoresist layer. There is then etched through use of a plasma etch method while employing the patterned photoresist layer as a photoresist etch mask layer the blanket metal layer to form a patterned metal layer. The patterned metal layer so formed has a metal impregnated carbonaceous polymer residue layer formed upon a sidewall of the patterned metal layer. There is then stripped from the patterned metal layer the patterned photoresist layer through use of an oxygen containing plasma while simultaneously oxidizing the metal impregnated carbonaceous polymer residue layer to form an oxidized metal impregnated polymer residue layer upon the sidewall of the patterned metal layer. There is then stripped from the sidewall of the patterned metal layer the oxidized metal impregnated polymer residue layer while employing an aqueous alkyl ammonium hydroxide based solution. The aqueous alkyl ammonium hydroxide based solution has incorporated therein a surfactant capable of forming a monolayer adsorbed upon the sidewall of the patterned metal layer.

Aqueous surfactant solution method for stripping metal plasma etch

A method of stripping photoresist and polymer from a wafer after a dry etch of a nitrade or a polysilicon layer that immerses the wafer in a peroxydisulfate (S.sub.2 O.sub.8.sup.2-)/HCl wet bath and while the wafer is still immersed, irradiates the wafer with a UV laser. The method comprises: (a) forming an silicon nitride layer 24 and a photoresist pattern 28 over a semi conductor structure 10; (b) dry etching the silicon nitride layer 24 thus forming a polymer 30 over the photoresist pattern, and the silicon nitride layer, (c) Immersing the substrate, the photoresist pattern, the polymer 30 in a liquid bath 34 comprising (1) peroxydisulfate (S.sub.2 O.sub.8.sup.2-), (2) HCl, and (3) water; and irradiating the photoresist pattern 28 and polymer layer 30 with a UV laser thereby removing the photoresist 28 and polymer 30.

Photoresist and polymer removal by UV laser aqueous oxidant

A method for forming an anti-reflective coating (ARC) layer within a fabrication and a fabrication having the anti-reflective coating (ARC) layer formed therein. To practice the method, there is first provided a substrate. There is then formed over the substrate a reflective layer. There is then formed upon the reflective layer an organic polymer anti-reflective coating (ARC) layer, where the organic polymer anti-reflective coating (ARC) layer is formed from an organic polymer anti-reflective coating (ARC) material which is not susceptible to a hydrolysis reaction. There may then be formed upon the organic polymer anti-reflective coating (ARC) layer a photoresist layer which is photoexposed and developed to form a patterned photoresist layer which may be employed as an etch mask for forming a patterned reflective layer from the reflective layer. The patterned reflective layer so formed is formed with uniform and reproducible linewidth dimension.

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Singapore, Singapore

Jian-Hui Ye