Winbond Electronics Corporation

Jia-Shing Jan

Chih-Jung Ni

Yueh-Liang Liu

A method of spiking a mixed acid liquid in a reactor is performed under three modes of control, a based-on-charge mode control, a based-on-time mode control, and a based-on-time-and-charge mode control. In the based-on-charge mode control, spike timing and spiking amount of an acid liquid are set for each lot of product. In the based-on-time mode control, the spike timing and the spiking amount of the acid liquid are set for each timing point. In the based-on-time-and-charge mode control, the spike timing and the spiking amount of an acid liquid are set for each lot of product and each timing point. Thereby, a concentration of the mixed acid liquid is controlled at a targetlevel.

Method of spiking mixed acid liquid in reactor

This application is about a method for removing the deep trench Si-needles on a wafer. The method includes steps of forming a photoresist layer on a frontside surface of the wafer, removing a specific area of the photoresist layer for exposing the Si-needles, proceeding a first etching and a second etching, and finally removing the photoresist layer on the frontside surface of the wafer. The first etching is a wet etching for removing the Si-needles by an etching solution etching from a backside surface of the wafer back to the frontside surface of the wafer. And, the second etching is a dry etching for removing the residual silicon nitride (SiN) slices formed during the first etching.

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Hsinchu, Taiwan

Jia-Shing Jan