Nalco Company

Cabot Microelectronics Corporation

Cmc Materials, Inc.

Other

Luon Energy LLC

Chemetall Gmbh

Ji Cui

Viet Lam

John David Kildea

Tina C Li

Alexander W Hains

Helin Huang

Timothy La

David H Slinkman

Sarah Brosnan

Chul Woo Nam

Juyeon Chang

Brian T Holland

Timothy S Keizer

Steven Grumbine

William J Ward

Kevin P Dockery

Everett C Phillips

Kailas B Sawant

Kevin O'Brien

Glenn Whitener

Pankaj K Singh

Frederick J Swiecinski

Kim Richard Coleman

Kim Long

Matthew Carnes

Hung-Tsung Huang

Chih-Hsien Chien

Nie Luo

Lizhang Yang

Chih-An Lin

Kevin L O'Brien

Lloyd E Hundley

The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.

Method to increase barrier film removal rate in bulk tungsten slurry

The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.

Surface treated abrasive particles for tungsten buff applications

The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and a cationic polymer. This invention additionally provides a method suitable for polishing a dielectric substrate.

Self-stopping polishing composition and method for bulk oxide planarization

Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka 'slurry') and an abrasive pad, e.g., CMP processing.

Methods and compositions for processing dielectric substrate

The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and optionally, a cationic polymer, and provides a method suitable for polishing a substrate.

Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.

Composition and method for removing residue from chemical-mechanical planarization substrate

This disclosure relates to a natural gas absorption device that includes (1) at least one porous, flexible container that has an average pore diameter and is permeable to natural gas, (2) a natural gas absorption material at least partially disposed in the container, the material having a volume average diameter larger than the average pore diameter of the container, and (3) a storage tank having an opening, the tank enclosing the container and the natural gas absorption material.

Natural gas adsorption devices

The invention provides a method of inhibiting the accumulation of DSP scale in the liquor circuit of Bayer process equipment. The method includes adding one or more particular silane based small molecules to the liquor fluid circuit. These scale inhibitors reduce DSP scale formation and thereby increase fluid throughput, increase the amount of time Bayer process equipment can be operational and reduce the need for expensive and dangerous acid washes of Bayer process equipment. As a result, the invention provides a significant reduction in the total cost of operating a Bayer process.

Reducing aluminosilicate scale in the bayer process

The invention provides a chemical-mechanical polishing composition comprising coated &#x3b1;-alumina particles, an organic carboxylic acid, and water. The invention also provides a chemical-mechanical polishing composition comprising an abrasive having a negative zeta potential in the polishing composition, an organic carboxylic acid, at least one alkyldiphenyloxide disulfonate surfactant, and water, wherein the polishing composition does not further comprise a heterocyclic compound. The abrasive is colloidally stable in the polishing composition. The invention further provides methods of polishing a substrate with the aforesaid polishing compositions.

Composition and method for polishing aluminum semiconductor substrates

Reducing aluminosilicate scale in the Bayer process

Diallcoxysilane and monoalkoxysilane functionalized polymers were applied as scale control agents in Bayer process. The polymer inhibitors reduced the quantity of aluminum silicate scale formed in spent liquor while significantly changed the morphology of the scale. Also a method is provided for reducing aluminum silicate scale of Bayer process by adding the dialkoxysilane and monoalkoxysilane functionalized polymer into the Bayer liquor stream.

Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer process

Disclosed and claimed is a composition that comprises a dispersion in a solvent of a compound comprising the reaction product of (1) a polyamine in which a plurality of amine groups are bonded to at least one radical comprising alkylene or arylene groups that separate the polyamine nitrogen atoms by at least four intermediate atoms in a chain, and (2) a silane which carries a plurality of silicon-bonded hydrolysable groups, and a silicon-bonded organic group that is covalently reactive with and which bonds with an amine group, to provide a reaction product molecule which comprises an average of at least about 2.5 of said silane groups per molecule. Some of these materials show superior advantage as a paint primer and some provide excellent corrosion resistance.

Water dispersible silanes

Disclosed and claimed is a novel protective coating for metal surfaces. The protective coating includes one part by weight of the organosilane-modified silica nanoparticles made by the disclosed process and further includes from 0.3 to 3 parts by weight of the reaction product of (1) a compound comprising a polyamine in which a plurality of amine groups are bonded to at least one radical selected from the group consisting of hydrocarbon and hydrocarbon ether groups that separate nitrogen atoms of said amine groups by at least four intermediate atoms in a chain, and (2) a silane which carries a plurality of silicon-bonded hydrolyzable groups and a silicon-bonded organic group that is covalently reactive to and which bonds with said amine group, said silane also comprising hydrolyzable groups, to provide a reaction product molecule which comprises an average of 2.5 to 3.5 silane groups per molecule.

Organically modified silica and use thereof

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Aurora, IL, United States of America

Ji Cui